There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.
December 08, 2022 by Toshiaki Hosoya, Toshiba
Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.
November 03, 2022 by Edwin Robledo, Fusion 360 Electronics
Learn some of the high-level basics of magnetic integrated connector modules (ICMs), some of the tasks they are used to accomplish, and look at an example product from Bel Fuse.
October 06, 2022 by Jeff Kring, Bel Magnetic Solutions & TRP Connector
Incompatible smart home products can be problematic for both customers and device manufacturers. Matter is a vendor-independent unifying standard that closes the gap between smart home ecosystems.
July 01, 2022 by Sujata Neidig, NXP Semiconductors
Learn the common problems and potential solutions for typical embedded real-time operating systems (RTOS) applications, along with Standardization and reusability issues and examples porting RTOS code in applications.
June 17, 2022 by Eli Hughes, NXP Semiconductors
With so many power tool options, designing for compatibility can be a struggle. Learn more about this challenge leveraging metal–oxide–semiconductor field-effect transistors (MOSFETs).
March 31, 2022 by Charles Keefer, Allegro MicroSystems