Andrew Dereka, Product Director Andrew Dereka is the product director for the thermoelectric cooler and thermoelectric cooler assemblies product lines at Laird Thermal Systems. Andrew has 20 years of thermal management experience working with leading OEM’s from around the globe learning about their thermal problems and helping to solve them. He has applications expertise in refrigeration for medical and analytical instrumentation, spot cooling for imaging and laser systems and ambient cooling for telecommunications cabinets. He has successfully launched more than 12 new thermal products into the market driving mass adoption. Andrew holds an MBA degree from Rutgers University and BSME from University of North Carolina in Charlotte.

Next Gen Thermoelectric Coolers Ramp Up Thermal Cycling Applications

In partnership with Laird


Thermal cycling exposes thermoelectric coolers to mechanical stresses as the module contracts and expands from repeated cooling and heating cycles. Standard thermoelectric coolers are traditionally designed for refrigeration applications. In thermal cycling applications, such as molecular diagnostic equipment, point of care devices and thermal test sockets, the high-temperature diffusion of impurities and mechanical stresses over time significantly reduces the operational life of standard thermoelectric coolers.

Utilizing advanced thermoelectric materials, next-generation thermoelectric coolers support applications that demand hundreds of thousands of thermal cycles with ultra-fast temperature ramp rates and tight temperature control with minimal gradient.

In this webinar, Editor-in-Chief Kate Smith and Laird Thermal Systems’ Product Director Andrew Dereka will discuss the latest in thermoelectric material technology and how modern thermoelectric coolers can lower operating costs and extend the mean time between failure (MTBF) in molecular diagnostics, clinical diagnostics, analytical instrumentation, and more.

Applications include:

  • PCR Thermal Cycling
  • DNA Amplification
  • Thermal Test Sockets
  • Point of Care Devices

People who should attend include:

  • Thermal design engineers
  • Thermal R&D engineers
  • Design engineers, hardware engineers, mechanical engineers, engineering management
  • Purchasing/procurement professionals

Free Webinar Registration

Already an AAC member? Please Click Here to login.

Fields containing * are required