Thermal cycling exposes thermoelectric coolers to mechanical stresses as the module contracts and expands from repeated cooling and heating cycles. Standard thermoelectric coolers are traditionally designed for refrigeration applications. In thermal cycling applications, such as molecular diagnostic equipment, point of care devices and thermal test sockets, the high-temperature diffusion of impurities and mechanical stresses over time significantly reduces the operational life of standard thermoelectric coolers.
Utilizing advanced thermoelectric materials, next-generation thermoelectric coolers support applications that demand hundreds of thousands of thermal cycles with ultra-fast temperature ramp rates and tight temperature control with minimal gradient.
In this webinar, Editor-in-Chief Kate Smith and Laird Thermal Systems’ Product Director Andrew Dereka will discuss the latest in thermoelectric material technology and how modern thermoelectric coolers can lower operating costs and extend the mean time between failure (MTBF) in molecular diagnostics, clinical diagnostics, analytical instrumentation, and more.
People who should attend include:
by CUI Devices