Francesco DiDomenico
Lead Principal Application Engineering
The right combination of topology and power semiconductor technology is essential to any SMPS design and its performance such as efficiency, power density, EMI, ability to operate in harsh environments, and many more.
In this webinar, Francesco DiDomenico, Lead Principal Application Engineering, Telecom System Competence Center Leader at Infineon Technologies Austria, guides the audience through the structural differences of Si, SiC, and GaN high-voltage power technologies and the benefits each technology brings to your SMPS design, including PFC and HV-DC-DC stage.
Register below to access the webinar. For more details on Infineon's WBG Technologies click HERE, and for additional information on Infineon's HV superjunction power MOSFET technology click HERE.
