Industry White Paper

XENSIV™ - TLE4972 sensing structure design application note

Application Note Overview

The Infineon application note provides sensing structure implementation guidelines for external current rail sensor of the current sensor family. The purpose of this document  is to enable system developers to design a sensing structure for current sensors in busbar based and PCB based applications. Intended audience. The application note is written for current sensors users who are dealing with the implementation of the product in the system.

Topics examined:

  • Sensing principles
  • Sensing structures and optimization
  • Lateral insertion on busbar support 
  • Current rail transfer factor and insertion resistance
  • How bandwidth will be influenced
  • The effects of misalignment
  • Understanding crosstalk

In this application note by Infineon, read sensing structure implementation guidelines for external current rail sensor of the XENSIV™ product family and learn to design a sensing structure for XENSIV™ current sensors in busbar based and PCB based applications.

Read Application Note:

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