Tape Out On Time With On-Demand Signoff DRC in P&R
White Paper Overview
Physical characteristics of devices have become progressively more complex even as design companies pack more devices on each die. Combining these characteristics with ever more demanding chip power, performance, and area (PPA) goals not only results in increased resource utilization but also challenges existing tools/flows/techniques.
This white paper looks at these challenges and explores techniques that can be used to close designs efficiently and deliver them on time.
Adding on-demand signoff-quality DRC verification inside P&R tools during digital implementation provides immediate feedback on targeted window-based DRC fixes. P&R engineers can spend less time running batch DRC, so they can focus on producing high-quality, optimized designs.