Industry White Paper

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

June 17, 2022 by Cadence
Topics Covered
  • Controlling 3D-IC Thermal and Stress Impact
  • 3D-IC Design Exploration
  • 3D-IC Signoff
  • Thermal Throttling Analysis

White Paper Overview

This white paper by Cadence helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius Thermal Solver helps designers analyze the impact and develop strategies to mitigate this impact, particularly for 3D-ICs.