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Amphenol ICC OSFP Interconnect System | New Product Brief

June 02, 2021 by Mouser Electronics

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

Amphenol ICC OSFP Interconnect Systems

Amphenol ICC OSFP Interconnect System is optimized for signal integrity performance and is built for use in high-speed serial applications. This OSFP footprint features 60 contacts per port with a 0.6mm contact pitch, supports up to 16W of power per port, and has eight high-speed channels that operate at 56 gigabits per second PAM-4 for up to 400 gigabits per second of aggregated bandwidth. This Amphenol solution is enhanced for low crosstalk and offers ground commoning for resonance dampening. Designed for 1U applications, the module side features an integrated heat sink for optimal thermal performance. The OSFP interconnect system supports passive copper as well as short and long-range optics.

  • Design for 1U applications
    • Signal integrity
    • High-speed serial
  • Features
    • 60 contacts per port support 16 high-speed pairs and 10 power/control pins
    • 0.6 mm contact pitch
    • Supports power up to 16W per port
    • 8 high-speed channels
      • Operating at 56Gb/s PAM-4 for up to 400Gb/s aggregated bandwidth solution
  • Advanced internal ground features provide improved crosstalk performance over QSFP28
  • Integrated heat sink
  • Supports passive copper as well as short and long-range optics

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