Molex Nano-Pitch I/O™ Interconnect System | New Product Brief
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
Molex Nano-Pitch I/O™ Interconnect System
Molex is now introducing the Nano-Pitch I/O™ Interconnect System that features industry-leading port density, multi-protocol application support, and high bandwidth performance for PCIe and SAS solutions within the storage industry and broader markets.
For low-profile, add-in card applications, the interconnect system has a 12 mm height of mated cables, well below the 14.47 mm height for components on PCIe add-in cards.
The small footprint utilizes 34 gauge, 85 ohm PCIe wires or, 32 gauge, 100 ohm SAS wires that are bundled inside a protective expando sleeve - this does not block airflow.
With data rates of 25 gigabits per second for the 80-circuit version and 16 gigabits per second for the 42-circuit version, the Nano-Pitch I/O™ Interconnect System can meet transfer needs with increased port density in smaller packaging.
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