The ADIN1300 is a low-latency, single-port Ethernet transceiver for gigabit-speed operation in harsh environments.
2 days ago by Gary Elinoff
Robust NVM (non-volatile memory) can now more easily co-exist with power functions on the same chip.
October 18, 2019 by Gary Elinoff
Legacy systems can now reap the benefits of the Industrial Internet of Things without PLC reprogramming.
October 11, 2019 by Gary Elinoff
Semtech’s LoRa Corecell reduces power consumption and conserves board space for indoor gateway applications.
October 04, 2019 by Gary Elinoff
Toshiba's newest family of SLC NAND memory products focuses on high transfer rates and providing an alternative to NOR memory.
September 27, 2019 by Gary Elinoff
Cree is doubling down on SiC with new facility expansions and the creation of what it claims will be the largest silicon carbide device manufacturing facility in the world.
September 26, 2019 by Gary Elinoff
A researcher has tested two competing IoT technologies, MYTHINGS and LoRa, against each other to see which one is more reliable. How did they do?
September 11, 2019 by Robin Mitchell
The new SiLabs units aim at the PLCs, relay drivers, and servo motor controllers employed in industrial automation.
August 30, 2019 by Gary Elinoff
TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.
August 29, 2019 by Gary Elinoff
From the typical pick-and-place down to the high-precision cobots, industrial robotics are changing rapidly.
August 26, 2019 by Gary Elinoff
The new ultra-high-voltage technology aims to reduce the size of MagnaChip's UHV nLDMOS devices by 30%.
August 13, 2019 by Gary Elinoff
DragonFly LDM extends the scope of 3D printing to the unattended, low-volume manufacturing of electronic circuitry.
July 29, 2019 by Gary Elinoff
Using Microsemi PolarFire FPGAs, the new program aims to enable compact, high-bandwidth, low-power system design.
July 16, 2019 by Gary Elinoff
The industrial IoT was the talk of Sensors Expo this year. Here's a roundup of some of the elements of the IIoT.
July 02, 2019 by Gary Elinoff
These new components debuted at Sensors Expo ahead of a new dev board for optical sensor development.
What is anisotropic magneto resistance? Check out examples of AMR-based current sensors on the market.
June 16, 2019 by Gary Elinoff
This new cellular chipset from u-blox emphasizes security and power savings.
June 13, 2019 by Gary Elinoff
Watch out, Moore's Law. Growing demands on memory have pushed semiconductor companies to pack more onto chips.
May 27, 2019 by Gary Elinoff
Get an update on the acquisitions and developments surrounding SiC chips, modules, and power stacks.
May 13, 2019 by Majeed Ahmad
With PCIM 2019 right around the corner, ON Semi has announced the launch of new SiC-based power components.
May 02, 2019 by Gary Elinoff
The single chip integrates 64-bit quad-core Arm Cortex-A53 and the dual-core Arm Cortex-R5 based processing system.
About 3 hours ago by Lisa Boneta
The ST8500 PLC chipset allows smart meters to communicate wirelessly through existing power cables or RF waves.
19 hours ago by Cabe Atwell
The three new members of Vishay's IHLP family feature inductances ranging from 0.10 to 3.3 µH and profiles as low as 1.0 mm.
About 24 hours ago by Gary Elinoff
Sized at only 1.5 mm2, members of the AS621x family offer a range of temperature accuracies for design flexibility.
3 days ago by Gary Elinoff
The I-CUBE-LRWAN Expansion Package allows developers to support the latest firmware updated over the air (FUOTA) specifications from the LoRa Alliance.
3 days ago by Lisa Boneta
The new evaluation board simplifies the process of evaluating gallium nitride-based, half-bridge or full-bridge power supplies.
4 days ago by Gary Elinoff
The ever-advancing field of artificial intelligence is opening new vistas for securing homes and public spaces alike.
November 09, 2019 by Gary Elinoff
The BMR4615001/001’s input ranges from 4.5 to 14 volts, while its output ranges from 0.6 to 3.3 volts.
November 08, 2019 by Gary Elinoff
Google’s OpenTitan is a collaborative venture with tech companies that offers multi-factor security keys and RoT technology, which will be baked into new chips.
November 08, 2019 by Cabe Atwell
The EVAL-M5-E1B1245N-SiC supports the design of industrial drive motor applications of up to 7.5 kW.
November 07, 2019 by Gary Elinoff
The new version of Simics provides a secure, shared platform aimed to help embedded developers virtually simulate a full target system.
November 06, 2019 by Lisa Boneta
The pre-engineered module aims to save developers the effort of finding and deploying separate sensing solutions.
November 06, 2019 by Gary Elinoff
The highly sensitive flicker sensor is designed to deliver distortion-free images and videos captured on a smartphone camera.
November 05, 2019 by Gary Elinoff
TI designed the new ADC to capture low-distortion audio recordings from far distances or in noisy environments.
November 05, 2019 by Lisa Boneta
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
November 04, 2019 by Robin Mitchell
Are modules a convenient timesaver? Or a harbinger of changes to how modern engineers design?
November 02, 2019 by Kate Smith
Concord Pro allows each player in the design process to share up-to-date component information.
November 01, 2019 by Gary Elinoff
The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.
November 01, 2019 by Lisa Boneta
Diode Incorporated’s 40V, 2.2MHz synchronous buck converters are designed for high efficiency across all loads.
October 31, 2019 by Gary Elinoff
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