The TI-RSLK Max allows students to gain hands-on experience building a robot and programming it.
September 06, 2019 by Gary Elinoff
What's new in RF?
September 03, 2019 by Gary Elinoff
A researcher has tested two competing IoT technologies, MYTHINGS and LoRa, against each other to see which one is more reliable. How did they do?
September 11, 2019 by Robin Mitchell
The dual N-channel devices offer DS breakdown voltages of 40 V and 60 V and current ratings of 25 A to 48 A.
September 15, 2019 by Gary Elinoff
The NCP1095 and NCP1096 deliver 90 Watts power-over-internet (POE) in compliance with IEEE's 802.3bt standard.
September 05, 2019 by Gary Elinoff
A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms.
September 05, 2019 by Majeed Ahmad
The 40V-rated DMTH4008LFDFWQ and the 60V-rated DMTH6016LFDFWQ sport space-saving DFN2020 packages.
September 16, 2019 by Gary Elinoff
Silicon carbide (SiC) power devices have been singled out by automakers for high-speed charging in automotive applications.
September 13, 2019 by Gary Elinoff
Ericsson is measuring 5G coverage areas and verifying their performance using drone-borne solutions from Rohde & Schwarz.
September 18, 2019 by Gary Elinoff
The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety.
September 12, 2019 by Majeed Ahmad
The SPM-VT series meets the high thermal and current demands of the automotive LED headlight environment.
September 04, 2019 by Gary Elinoff
DARPA’s Subterranean (SubT) Challenge seeks to find new ways to cope with complex underground environments.
September 02, 2019 by Gary Elinoff
Dialog Semi's four new high-frequency, I2C-controlled buck converters aim to save onboard space and external component count.
September 19, 2019 by Gary Elinoff
NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.
September 09, 2019 by Gary Elinoff
Composed of 35 billion transistors, the VU19P is the newest member of the 16 nm Virtex UltraScale+ family.
August 28, 2019 by Gary Elinoff
The new SiLabs units aim at the PLCs, relay drivers, and servo motor controllers employed in industrial automation.
August 30, 2019 by Gary Elinoff
Power Integrations' AEC-Q100-qualified LQ10N200CQ and LQ20N200CQ diodes target automotive audio systems.
Learn the different ways companies are using time-of-flight 3D sensor technology to create products for facial recognition, smart cars, and manufacturing.
August 24, 2019 by Gary Elinoff
TDK's newest devices span applications in both liquid and air-based media.
September 20, 2019 by Gary Elinoff
Based on the Loihi research chip, Intel's new system is capable of simulating 8-million neurons.
July 15, 2019 by Gary Elinoff
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