The new Toshiba devices are embedded flash memory units that integrate FLASH 3D flash memory and a controller in a single package. The high memory capacity of these devices is due to their bit cost scalable (BiCS) architecture that involves building many layers of memory structure on top of each other.
Toshiba’s previous generation of 64 Layer stacked memory. Screenshot of video courtesy Toshiba.
BiCS structure can be envisioned by comparing a single-storied dwelling to a multi-floored apartment complex. The result is a memory chip of enormous capacity that takes up comparatively little board real-estate.
UFS Memory Rises to the Challenge of the Automotive Environment
Toshiba Memory's Universal Flash Storage (UFS) is widely used today in a variety of devices, including the ubiquitous smartphone. As Scott Beekman, Director of Managed Flash Memory Products, sees things, “It’s only natural that automotive applications follow the same course.”
And they’ll certainly be facing some tough challenges. While the passenger compartment of a modern vehicle is almost as comfortable as a living room, the rest of the vehicle presents enormous challenges to any electronic device. There are extremes of temperature, humidity, ice and snow, as well as circuit-crunching shock and vibration. And with connected cars and autonomous vehicles expected to generate enormous quantities of data, the storage requirements for automotive applications will continue to increase.
3D Flash Memory Enabled UFS Devices for Automotive Applications. Image courtesy Toshiba.
To help them live up to the challenges they’ll face, these new UFS devices feature several functions including new Refresh, Thermal Control, and Extended Diagnosis functions.
- The Refresh function can be used to refresh data stored in UFS and helps extend the data’s lifespan.
- The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications.
- The Extended Diagnosis function helps users easily understand the device’s status.
In addition, all members of the new line adhere to the Joint Electron Device Engineering Council’s (JEDEC) Universal Flash Storage (UFS) standard specification.
All members of the new memory family feature the JEDEC UFS Version 2.1 standard HS-G3 interface and require power supply voltages of 2.7V-3.6V for the memory core and 1.70V-1.95V for the interface.
Features for the individual devices include:
|THGAFBG8T13BAB7||32GB||153Ball FBGA||11.5 x 13.0 x 1.0mm||2Q, 2019 (Apr.-Jun.)|
|THGAFBG9T23BAB8||64GB||153Ball FBGA||11.5 x 13.0 x 1.2mm||Available|
|THGAFBT0T43BAB8||128GB||153Ball FBGA||11.5 x 13.0 x 1.2mm||Available|
|THGAFBT1T83BAB5||256GB||153Ball FBGA||11.5 x 13.0 x 1.3mm||Available|
What role do you see flash memory playing in automotive applications in the future? Have you worked with automotive flash memory? Share your expertise in the comments below.