An Overview of KEMET KONNEKT™ | Tech Chats - with KEMET

June 11, 2020 by Mouser Electronics and KEMET

Chris Anderson chats with Dr. John Bultitude of KEMET about KEMET KONNEKT™, a high density packaging technology for more capacitance in the same board space.

Tech Chats is a video series highlighting long-form conversations with industry experts about the features, applications, and technical specs of newly-released products.

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KEMET Electronics KONNEKT™ U2J in High-Efficiency High-Density Power.

KEMET Electronics KC-LINK™ Capacitors with KONNEKT™ Technology.