New Products

Automotive CoolSiC™ EasyPACK 1B

August 30, 2020 by Infineon

Robust SiC-Technology meets flexible half-bridge concept.

The new EasyPACK 1B, 7.33 mΩ halfbridge module FF08MR12W1MA1_B11A combines the new CoolSiC Automotive Trench-MOSFET 1200V technology, an NTC temperature sensor, and the PressFIT contact technology.