HyperRAM™ devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler.
New W35N-JW NAND products featuring Winbond’s OctalNAND Flash offer robust and reliable code storage in automotive and industrial applications.
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, recently announced a new version of QspiNAND Flash designed for use with the Qualcomm® 9205 LTE Modem.
New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication.
Don't have an AAC account? Create one now.
Forgot your password? Click here.