Industry White Papers

Attributes of High‑performance Power Module Packaging

September 14, 2021 by Vicor

From the first Brick to today’s ChiP™ (Converter housed in Package), Vicor has been continually innovating packaging technology to deliver higher performance solutions to power system engineers. Vicor consistently leads the industry in advancing: high power and current density, thermal adeptness, integrated magnetics, compatibility with high volume PCB assembly techniques.