TE Connectivity Chipconnect internal faceplate-to-processor cable assemblies enable Intel’s Omni-Path Architecture for data centers and high-performance computing.
March 07, 2018 by Mouser Electronics
Analog Devices HMC family of RF and microwave connectorized modules are high performance, high reliability, hermetically sealed modules that can be used in prototyping and development to reduce the design time for telecom, test equipment, electronic warfare, aerospace, and radar applications.
September 20, 2017 by Mouser Electronics