Could the Next Step in Wearables be E-Tattoos?
Where other wearables falter, e-tattoos are showing major promise, especially in the medical field regarding blood pressure monitoring.
Breath-controlled IoT Expands Accessibility to the Smart Home
For people unable to use voice- or touch-controlled IoT devices, the nose-clip prototype may make breath-based home automation a reality.
Deliver 3D IC Innovations Faster
Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How…
Smart Locks Use Smartphone NFC to Unlock—All Without a Battery
Infineon has revealed a new chip that may unlock the answer to battery-less IoT appliances—particularly smart locks.
System-level Connectivity Management and Verification of 3D IC Heterogeneous Assemblies
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built…
Amar Bose, the Man Behind the Headphones
His name became legendary in the world of consumer audio, but Bose—professor, researcher, engineer, inventor—was much more than a business-savvy audiophile.
Why SoCs Need NoCs: Network on Chip and the Future of Computing
In a complex heterogeneous computing ecosystem, the development of network-on-chip interconnects is essential to the progress of system-on-chip technology.
Offset Error and Gain Error in a Bipolar ADC and Differential ADC
Concerning analog-to-digital converters (ADCs), learn about offset errors and gain errors in a bipolar ADC and differential ADC as well as offset error…