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FET Roundup: eGaN FETs, Next-gen SiC FETs, and “RibbonFETs” Hit the Scene

This month has been a busy one in the FET space. Here are a few FETs from EPC, UnitedSiC, and Intel that depart from traditional silicon transistors in interesting ways.

About 8 hours ago by Ikimi .O

DARPA Commissions Transphorm to Develop N-polar GaN on Sapphire Substrates

Disrupting the Ga-polar GaN technology tradition with N-polar GaN devices, Transphorm is evaluating the cost vs. performance of sapphire substrates with a new DARPA contract.

one day ago by Adrian Gibbons

Renesas’ New RA2E2 32-bit MCUs Promises More Scalable IoT Designs

Based on the Arm Cortex-M23 32-bit core, the RA2E2 microcontroller unit (MCU) group hopes to bring more scalability to the internet of things (IoT) endpoint applications.

one day ago by Abdulwaliy Oyekunle

Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Inspired by GitHub, a new browser-based hardware development tool has recently raised $12M in funding.

2 days ago by Jake Hertz

New Sensor Claims an “Industry First” for Detecting Harmful UV-A Radiation

Built for wearable devices, the new UV-detection chip can help users monitor their exposure to the most harmful type of radiation: UV-A.

2 days ago by Kristijan Nelkovski

World’s First TinyML Vision Challenge Crowns 2021 Winners

Competitions are always an exciting way to test the limits and ingenuity of both technology and the designer. This week the winners of the first inaugural TinyML Vision Challenge were announced.

3 days ago by Jake Hertz

Samsung Potentially Takes the Lead on Tesla’s Self-driving Chips

How will Samsung's involvement affect Tesla's silicon-level trajectory in autonomous driving?

3 days ago by Tyler Charboneau

Understanding 5G New Radio in Non-standalone Operation Applications

The 5G New Radio platform is continuing to evolve. A clear understanding of 5G goals, technical terms, and technology will allow designers to imagine new use-cases for the nascent network.

4 days ago by Adrian Gibbons

Cadence Releases First ECAD Platform Dedicated to 3D System Design

The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.

4 days ago by Adrian Gibbons

Brill Power’s Intelligent BMS Hopes to “Revolutionize” Energy Storage Systems

Brill believes its new technique in battery balancing can help significantly increase battery life and capacity.

5 days ago by Jake Hertz

Microchip Targets Temperature Stability in New Cost-effective Vref IC

When it comes to voltage references, not only are they important, but they must be stable, especially when it comes to temperature. Targeting just that, Microchip has released a new voltage reference IC.

5 days ago by Jake Hertz

Pre-switching, a New Contrast to Hard-switching, Eliminates Switching Losses With AI

A novel "pre-switch" architecture may allow designers to break free from hard-switching constraints.

October 10, 2021 by Ikimi .O

ST Speeds to a More Wireless World with 70W Fast Wireless Charging Chipset

In a world demanding fewer wires, ST’s new wireless power receiver chip promises to deliver fast and efficient wireless charging to mobile and wearable devices.

October 09, 2021 by Kristijan Nelkovski

High-speed Contactless Connectors Aim to Solve Connector-related Failures

Aiming to make the connectors have fewer wires, a collaboration between ST and Rosenberger has resulted in a novel, high-speed, contactless connector technology.

October 08, 2021 by Jake Hertz

Facebook Open-sources Its Newest Hardware, the Time Appliance Project

The Time Appliance Project (TAP) is Facebook’s newest sub-microsecond network time synchronization system. Designed to enhance data centers, it is open-source, well documented, and ready to review.

October 08, 2021 by Adrian Gibbons

Micron Seeks to Solve Data Center Challenges with New Generation SSD

Data centers are facing serious challenges as technology continues to boom and Micron is out to keep them at bay with its latest solid-state drive.

October 07, 2021 by Jake Hertz

A New Optical Switch Proves 1,000 Times Faster Than Traditional Transistors

Optical computers have long been on the horizon. Now, IBM and Skoltech are teaming up to bring optical circuits into the mainstream.

October 07, 2021 by Adrian Gibbons

Two AI Processors Push Computer Vision to the Next Level for IoT and Automotives

Hoping to create more power-efficient and highly functional AI processors, Syntiant and Intuitive are both aiming to create the next step in computer vision.

October 06, 2021 by Jake Hertz

Hokuyo Automation Boosts 4D LiDAR Leveraging SiLC’s FMCW Single Chip Technology

Hokuyo Automation and SiLC Technologies are teaming up to push 4D LiDAR to mainstream using frequency modulated continuous wave technology (FMCW). However, what is 4D LiDAR and SiLC's chip solution?

October 05, 2021 by Antonio Anzaldua Jr.

Packing Power: New Family of Flyback Switcher ICs Integrates USB PD Controller

Power Integrations' new InnoSwitch3-PD family is said to reduce the number of the required components by about 50 percent compared to conventional solutions. 

October 05, 2021 by Dr. Steve Arar