Position trackers and position sensors are fundamentally different. Yet sometimes outside of engineering spaces, we hear the terms used interchangeably. Here's why the distinction matters.
About 7 hours ago by Tyler Charboneau
Available in ultra-thin QFN (UQFN) packages, the new devices measure at 3mm x 3mm x 0.65mm.
one day ago by Gary Elinoff
BOXiedge is a 24-core mini-server driven by an SoC clocked at 1GHz. What about this solution speaks to the trend toward edge computing?
2 days ago by Robin Mitchell
The SZ1101 (33W) and SZ1105 (65W) incorporate four key ACF subsystems to simply design and reduce BOM count.
2 days ago by Gary Elinoff
Based on familiar COTS devices, these two radiation-hardened devices are designed to facilitate space-based Ethernet connectivity.
3 days ago by Gary Elinoff
Renesas’ ISL91301B PMIC is featured in Google’s Coral devices, including the Mini PCIe Accelerator, M.2 Accelerator, and SoM.
3 days ago by Cabe Atwell
The ML100E series offers 41 standard models with varying VDC inputs and output ranges along with short circuit protection and a wide range of temperature tolerances.
Qorvo claims that ACT475M is the industry’s first AEC-Q100-qualified PMIC DC-DC buck converter aimed at USB Type-C fast charging applications.
4 days ago by Gary Elinoff
The TMC7300 can deliver two amps to drive either one or two DC motors, relays, and LEDs.
5 days ago by Gary Elinoff
CES 2020 offered new insights and product announcements regarding 5G, automotive, IoT, and AI. But which of these trends should engineers pay attention to?
5 days ago by Lisa Boneta
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.
5 days ago by Cabe Atwell
Whether we like it or not, electrical engineers are deeply implicated in the world’s confusing and expensive quest for quality of life.
January 12, 2020 by Robert Keim
This article reviews how AI is making its way into education, which in turn may direct the future of Industry 4.0.
January 11, 2020 by Cabe Atwell
Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.
January 10, 2020 by Gary Elinoff
The new power management IC is said to help designers build smaller, less intrusive automotive camera systems.
January 09, 2020 by Gary Elinoff
SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.
January 09, 2020 by Tyler Charboneau
The OpenRTK330L is said to deliver cm-level accuracy during GNSS outages and is fully customizable with open-source algorithms.
January 08, 2020 by Lisa Boneta
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
January 08, 2020 by Gary Elinoff
Micron claims that the new DDR5 will provide an 85% increase in memory performance in the next generation of server workloads.
January 07, 2020 by Lisa Boneta
NXP designed S32G, a vehicle network processor, to reduce software complexity and enhance data security.
January 07, 2020 by Gary Elinoff
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