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TI Adds Agentic AI to CCStudio and Launches a Multiprotocol Industrial Ethernet Module

TI Adds Agentic AI to CCStudio and Launches a Multiprotocol Industrial Ethernet Module

TI is giving AI coding agents direct access to its device data and debugger, and says a new porting skill cuts migration work from months to days. A firmware-selectable communications module and an IO-Link master arrive alongside it.


News one hour ago by Dale Wilson
Tektronix Unveils Low Cost Scope With 12-Bit ADC and Built-In Bode Plots

Tektronix Unveils Low Cost Scope With 12-Bit ADC and Built-In Bode Plots

Announced today, the entry-level oscilloscope family targets the expanding overlap of IoT sensing, modern power topologies, and university engineering labs. It’s armed with a new FPGA architecture and a touch interface.


News 20 hours ago by Jeff Child
NXP Unwaps Unified Robotics Platform for Trusted Physical AI Designs

NXP Unwaps Unified Robotics Platform for Trusted Physical AI Designs

Announced today, NXP’s new unified robotics platform provides a "neural axis" architecture and pre-validated drone reference designs to accelerate trusted physical AI system deployment.


News Nov 09, 2026 by Jeff Child
Better Connections: 4 New Connectors Target Industrial, Auto, and More

Better Connections: 4 New Connectors Target Industrial, Auto, and More

Four companies introduce connectors that address common engineering design issues in the industrial, high-speed communication, and automotive industries.


News Nov 04, 2026 by Joshua Tidwell
Allegro Debuts 48 V Power ICs and Precision Sensors for Humanoid Robotics

Allegro Debuts 48 V Power ICs and Precision Sensors for Humanoid Robotics

The new sensing and power portfolio addresses critical size, weight, and safety challenges in physical AI, enabling near-human dexterity and high torque density in modern robotics.


News Oct 30, 2026 by Jeff Child
Altera Unveils a New Agilex FPGA Portfolio and Agentic AI Developer Tool

Altera Unveils a New Agilex FPGA Portfolio and Agentic AI Developer Tool

Announced today, Altera has a new FPGA portfolio along with an AI expert companion designed to accelerate development for next-generation digital and physical AI fabrics.


News Oct 28, 2026 by Jeff Child
Summit 2026 - Unlocking the Next Generation of Connected Homes With Wi-Fi 7

Summit 2026 - Unlocking the Next Generation of Connected Homes With Wi-Fi 7

Infineon Wi-Fi 7 technology enables smart home with seamless interoperability, advanced environmental sensing, and energy-efficient connectivity.


Summit 2026 - Next-Gen Edge AI: Building Intelligent Vision Systems with PSOC™ Edge

Summit 2026 - Next-Gen Edge AI: Building Intelligent Vision Systems with PSOC™ Edge

Discover how enhanced neural processing and memory simplify system development to deliver low-latency, power-efficient intelligence at the edge without cloud reliance.


Summit 2026 - Collecting Data for Your Edge AI Project: From Vision to Sensor Fusion

Summit 2026 - Collecting Data for Your Edge AI Project: From Vision to Sensor Fusion

Demystify collecting high-quality data from sensors using DEEPCRAFT™ Studio! This presentation equips you to gather data and get AI models running on the edge.


Researchers Turn a Laser-Ionized Air Filament Into a Radio Antenna

Researchers Turn a Laser-Ionized Air Filament Into a Radio Antenna

A plasma filament driven through a contactless capacitive ring increased received signal strength 2.5 times at 30 MHz.


News Oct 26, 2026 by Luke James
Tech Shorts: 5 New Sensors Target Robots, Underwater Cameras, and More

Tech Shorts: 5 New Sensors Target Robots, Underwater Cameras, and More

Benewake, STMicroelectronics, TDK, and Vishay released sensors for near-field robot safety, dive-ready wearables, GNSS-free navigation, redundant motor control, and optical data links.


News Oct 21, 2026 by Luke James
Summit 2026 - Connecting Physical AI: Interconnect and Antenna Solutions for Humanoid Robots

Summit 2026 - Connecting Physical AI: Interconnect and Antenna Solutions for Humanoid Robots

Join us as we break down the humanoid system to examine key connectivity challenges and design approaches across vision, control, power distribution, and movement.


News Oct 21, 2026 by TE Connectivity
Summit 2026 - Beyond 2D: Robotic Environmental Awareness with 3D ToF and RGB Sensor Fusion

Summit 2026 - Beyond 2D: Robotic Environmental Awareness with 3D ToF and RGB Sensor Fusion

Join Infineon and pmdtechnologies for a demo-driven webinar on combining precise distance data with rich texture to elevate performance, reliability, and ROI.


Summit 2026 - Advanced Position Sensing Solution For Humanoid Robots

Summit 2026 - Advanced Position Sensing Solution For Humanoid Robots

Infineon’s XENSIV™ Hall sensors enable precise motor control and tactile sensing in hands. Learn key design requirements and engineering challenges for stable, reliable robotic motion.


Summit 2026 - Beyond Piezo: The Future of Ultrasound with XENSIV™ MEMS Ultrasonic Transceiver

Summit 2026 - Beyond Piezo: The Future of Ultrasound with XENSIV™ MEMS Ultrasonic Transceiver

XENSIV™ MEMS transceivers enable smaller, more integrated, and highly scalable sensing solutions. Learn key design considerations and emerging use cases across robotics and automation.


Summit 2026 Keynote - Intelligence with Consequences: Developing Physical AI for a Better World

Summit 2026 Keynote - Intelligence with Consequences: Developing Physical AI for a Better World

Renesas UX leader Ivo Marocco explores physical AI and intelligence at the edge. He details how autonomous systems and humanoid robots must be developed responsibly, safely, and efficiently.


News Oct 21, 2026 by Renesas Electronics
Efinix Buckles Down on 64-bit RISC-V Performance for Embedded FPGA Designs

Efinix Buckles Down on 64-bit RISC-V Performance for Embedded FPGA Designs

Efinix expands its Sapphire RISC-V SoC family with a configurable 64-bit processor offering larger memory support, Linux capability and FPGA acceleration for embedded and edge AI designs.


News Oct 19, 2026 by Joshua Tidwell
Microchip Unwraps New 10BASE‑T1S ICs to Scale Edge Connectivity

Microchip Unwraps New 10BASE‑T1S ICs to Scale Edge Connectivity

Two transceivers and a family of endpoints with integrated transceivers add to Microchip’s single pair Ethernet portfolio.


News Oct 14, 2026 by Duane Benson
Summit 2026 - Industrial Connectivity: Applications Driving the Next Wave of Growth

Summit 2026 - Industrial Connectivity: Applications Driving the Next Wave of Growth

Join experts from Molex to explore how industrial connectivity supports reliable power, signal, and data solutions as connected operations expand beyond the factory floor.


News Oct 14, 2026 by Molex Incorporated
Summit 2026 - Advancing Battery Safety Through Early Thermal Runaway Detection

Summit 2026 - Advancing Battery Safety Through Early Thermal Runaway Detection

Join this webinar to discover how Infineon's pressure sensors enable early thermal runaway detection and improve battery safety through fast, reliable pressure monitoring.