The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health…
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice…
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs…
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.
Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on…
Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a…
The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI…
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's…
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and…
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.
U-blox has introduced the MAYA-W5 and NORA-W5 Wi-Fi 6 module families for industrial and IoT applications, designed and…
U-blox has introduced the MAYA-W5 and NORA-W5 Wi-Fi 6 module families for industrial and IoT applications, designed and manufactured in Europe.
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited…
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor,…
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.
The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive…
The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread…
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
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