The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.
The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
By treating spinal cord injuries as a signal-integrity challenge, engineers are using deep learning and wireless…
By treating spinal cord injuries as a signal-integrity challenge, engineers are using deep learning and wireless technology to successfully reconnect the brain to paralyzed limbs.
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread…
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive…
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive accessory applications.
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds…
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell faults and mitigate thermal runaway.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled…
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband…
Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.
New audio releases use spatial audio, MEMS, and hybrid designs to improve immersion and sound quality.
New audio releases use spatial audio, MEMS, and hybrid designs to improve immersion and sound quality.
The new GUI tool comes with features for automated AI development and deployment of Nuvotion MCU firmware.
The new GUI tool comes with features for automated AI development and deployment of Nuvotion MCU firmware.
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring…
Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic…
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.
Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to…
Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to support HMI and IoT edge applications.
The new plug-in module is designed to meet the timing and synchronization requirements of distributed computing, AI data…
The new plug-in module is designed to meet the timing and synchronization requirements of distributed computing, AI data centers, and upcoming 5G networks.
The module brings Intel's NPU-integrated processors to entry-level x86 systems, scaling edge AI performance and…
The module brings Intel's NPU-integrated processors to entry-level x86 systems, scaling edge AI performance and simplifying integration and long-term upgrades.
The new motor control device simplifies high-efficiency brushless DC systems by combining a 32-bit processor with a…
The new motor control device simplifies high-efficiency brushless DC systems by combining a 32-bit processor with a specialized hardware vector engine.
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