The Seattle startup has reached a $1.6 billion valuation by turning Bluetooth LE chips into globally trackable assets—all the way from space.
The Seattle startup has reached a $1.6 billion valuation by turning Bluetooth LE chips into globally trackable assets—all the way from space.
Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and…
Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and lifecycle management for data center and AI chips.
The Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 are the first mobile SoCs to break the 5 GHz barrier, while…
The Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 are the first mobile SoCs to break the 5 GHz barrier, while Snapdragon Sound Elite Gen 2 targets camera-equipped AI wearables.
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor…
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.
Nordic Semiconductor's nRF54LC10A combines Bluetooth LE, Thread, Zigbee, and Matter support with low power consumption…
Nordic Semiconductor's nRF54LC10A combines Bluetooth LE, Thread, Zigbee, and Matter support with low power consumption and advanced security in a compact package for IoT devices.
A new addition to Nvidia's CUDA-Q quantum computing platform adds logical qubit error correction and abstraction to…
A new addition to Nvidia's CUDA-Q quantum computing platform adds logical qubit error correction and abstraction to significantly speed reliable quantum application development.
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
In this Retro Register, we look back at the first EEPROM-based microcontroller and how a cheap chip with a simple…
In this Retro Register, we look back at the first EEPROM-based microcontroller and how a cheap chip with a simple programming interface created the hobbyist MCU scene.
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring…
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring flagship AI performance to fanless Googlebooks.
Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and…
Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and built-in peripherals for secure IoT and industrial system control.
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control,…
The Compact Vision 5 HMI and SBC-Dragonwing-IQ-2390 give industrial OEMs two ways to deploy edge AI, real-time control, and modern connectivity on a unified Qualcomm platform.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end…
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end compute and proactive mobile intelligence.
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development…
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.
M6 is Apple's first 2-nm chip and features a dual 16-core Neural Engine, while the M5 Ultra joins four dies to achieve…
M6 is Apple's first 2-nm chip and features a dual 16-core Neural Engine, while the M5 Ultra joins four dies to achieve 1.2 TB/s of unified memory bandwidth.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated…
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated Ensemble and Balletto MCUs.
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4…
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.
Select Versal RF Series devices will be AMD's first adaptive SoCs with native UCIe 1.1 interfaces, allowing designers to…
Select Versal RF Series devices will be AMD's first adaptive SoCs with native UCIe 1.1 interfaces, allowing designers to co-package third-party chiplets.
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