The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.
The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI…
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's…
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and…
The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.
Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate…
Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate at roughly 6 mW.
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited…
The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.
Intel's 1980 microcontroller put a CPU, memory, timers, and serial I/O on a single chip. It’s an architecture that…
Intel's 1980 microcontroller put a CPU, memory, timers, and serial I/O on a single chip. It’s an architecture that still ships inside billions of devices.
Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts…
Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.
Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable…
Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor,…
The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.
The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive…
The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.
The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.
The 120 MHz GD32E512 is optimized for high-speed optical modules and the 72 MHz GD32E252 takes on low-speed optical modules.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
By treating spinal cord injuries as a signal-integrity challenge, engineers are using deep learning and wireless…
By treating spinal cord injuries as a signal-integrity challenge, engineers are using deep learning and wireless technology to successfully reconnect the brain to paralyzed limbs.
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread…
Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive…
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive accessory applications.
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds…
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell faults and mitigate thermal runaway.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled…
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level…
At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.
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