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Test & Measurement
ST and Mikroe Collaborate on “Click Boards” for STSPIN Motor Driver ICs in Embedded Systems
The Click boards extend the reach of ST's STSPIN motor driver ICs into the Mikroe ecosystem.
3 days ago
ROHM’s New Family of 4-Pin Trench-Gate SiC MOSFETs Aims to Reduce Switching Losses
The SCT3xxx xR series, available in 650V and 1200V VDS versions, can reduce switching losses by up to 35%.
October 11, 2019
Renesas Introduces Security-Focused RA Family of Arm-Based MCUs
The new devices, based on the Arm Cortex-M, bring advanced security to edge devices and IoT endpoints.
October 09, 2019
Where KNX Stands in Building Automation Designs
The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety....
September 12, 2019
Firmware Enables Gas Sensors to Personalize Monitoring Services
A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms....
September 05, 2019
High-speed Interfaces Bolster Connectivity in SSD Controllers
The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity and speed of flash memory they serve in SSD designs....
August 27, 2019
Security Flaw Found in Xilinx Zinc UltraScale+ Encrypt Only Secure Boot
Security flaws can leave products vulnerable and give engineers sleepless nights. Recently, a new security flaw was found in Xilinx's Zynq UltraScale+ SoC devices' encrypt only secure boot....
August 23, 2019
Nissan Adopts Renesas SoC and MCU for Assisted Driving Platform
Nissan has adopted Renesas's R-Car SOC and RH850 MCU for its ProPilot2 driver assistance system.
August 08, 2019
Dialog Semiconductor Releases Automotive-Grade Version of GreenPak CMIC
Today, Dialog Semiconductors announces a GreenPak configurable mixed-signal IC that has been cleared for use in the automotive industry.
August 07, 2019
3D Printing Electronic Components? Nano Dimension Releases DragonFly LDM Manufacturing Platform
DragonFly LDM extends the scope of 3D printing to the unattended, low-volume manufacturing of electronic circuitry.
July 29, 2019
What Does It Mean for an SoC to Be Secure? A Closer Look at the Wireless Gecko Series 2
What makes a secure SoC actually... secure? Check out this overview of hardware-based security features in a real-world example IC.
July 24, 2019
Secure Microcontrollers Address IoT Security
Security is increasingly something EEs need to be cognizant of in their component choices. Here's an overview of three secure microcontrollers....
July 23, 2019
Microchip Announces Smart Embedded Vision Initiative for Machine Vision System Design
Using Microsemi PolarFire FPGAs, the new program aims to enable compact, high-bandwidth, low-power system design.
July 16, 2019
Key Design Building Blocks Falling into Place for Smart Hearables
Low-power components, voice activation platforms and development kits enable designers to create wireless earbuds, hearing aids, and smart headsets operating on small batteries....
June 24, 2019
Design Automation Conference Kicks Off in Las Vegas
Design Automation Conference runs June 3-6 with a theme of "From Chips to Systems–Learn Today, Create Tomorrow."
June 03, 2019
STMicroelectronics Unveils the STM32G4 Series of Microcontrollers
ST's new MCUs target applications in e-mobility, digital power supplies, motor control, lighting, and building automation.
May 30, 2019
How Do Avionics Systems Communicate? New ARINC-429 Bus Board Announced by UEI
Learn about a new board that uses an FPGA for serial communication in avionics applications.
May 28, 2019
Audio SoCs Prove Vital for Always-on Voice Activation Platforms and Edge Device AI
As voice-activated digital assistant devices continue to gain popularity, AI- and audio-focused SoCs evolve.
April 29, 2019
Intel Addresses Data Center Needs with Field Programmable Gate Array Series
The 3D System In Package (SiP) FPGAs are also targeted for embedded and network applications.
April 04, 2019
Popular Toshiba Flash Memory Platform Now Qualified for Automotive Applications
The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.
March 27, 2019
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