Embedded News

The SCT3xxx xR series, available in 650V and 1200V VDS versions, can reduce switching losses by up to 35%.

The new devices, based on the Arm Cortex-M, bring advanced security to edge devices and IoT endpoints.

The wired Fieldbus connectivity standard is getting a foothold in the IoT world by facilitating smart building solutions for lighting, HVAC, access control, and fire safety....

A new chapter begins for miniaturized gas sensors equipped with ASIC-based hardware and configurable software capable of rapidly adopting new sensing platforms....

The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity and speed of flash memory they serve in SSD designs....

Security flaws can leave products vulnerable and give engineers sleepless nights. Recently, a new security flaw was found in Xilinx's Zynq UltraScale+ SoC devices' encrypt only secure boot....

Nissan has adopted Renesas's R-Car SOC and RH850 MCU for its ProPilot2 driver assistance system.

Today, Dialog Semiconductors announces a GreenPak configurable mixed-signal IC that has been cleared for use in the automotive industry.

DragonFly LDM extends the scope of 3D printing to the unattended, low-volume manufacturing of electronic circuitry.

What makes a secure SoC actually... secure? Check out this overview of hardware-based security features in a real-world example IC.

Security is increasingly something EEs need to be cognizant of in their component choices. Here's an overview of three secure microcontrollers....

Using Microsemi PolarFire FPGAs, the new program aims to enable compact, high-bandwidth, low-power system design.

Low-power components, voice activation platforms and development kits enable designers to create wireless earbuds, hearing aids, and smart headsets operating on small batteries....

Design Automation Conference runs June 3-6 with a theme of "From Chips to Systems–Learn Today, Create Tomorrow."

ST's new MCUs target applications in e-mobility, digital power supplies, motor control, lighting, and building automation.

Learn about a new board that uses an FPGA for serial communication in avionics applications.

As voice-activated digital assistant devices continue to gain popularity, AI- and audio-focused SoCs evolve.

The 3D System In Package (SiP) FPGAs are also targeted for embedded and network applications.

The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.