By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end…
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end compute and proactive mobile intelligence.
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development…
Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.
M6 is Apple's first 2-nm chip and features a dual 16-core Neural Engine, while the M5 Ultra joins four dies to achieve…
M6 is Apple's first 2-nm chip and features a dual 16-core Neural Engine, while the M5 Ultra joins four dies to achieve 1.2 TB/s of unified memory bandwidth.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated…
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated Ensemble and Balletto MCUs.
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4…
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.
Select Versal RF Series devices will be AMD's first adaptive SoCs with native UCIe 1.1 interfaces, allowing designers to…
Select Versal RF Series devices will be AMD's first adaptive SoCs with native UCIe 1.1 interfaces, allowing designers to co-package third-party chiplets.
RackCommander groups MaxLinear's USB UARTs, RS-485 transceivers, GPIO expanders, and power devices for rack-level management.
RackCommander groups MaxLinear's USB UARTs, RS-485 transceivers, GPIO expanders, and power devices for rack-level management.
In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall…
In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall Street financing to washing machines.
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and…
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless…
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.
The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.
The team employed a quantum material and chip architecture that could be key in scaling quantum computers to one million qubits.
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF…
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health…
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice…
The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team…
In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.
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