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Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Inspired by GitHub, a new browser-based hardware development tool has recently raised $12M in funding.

October 14, 2021 by Jake Hertz

Cadence Releases First ECAD Platform Dedicated to 3D System Design

The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.

October 12, 2021 by Adrian Gibbons

Facebook Open-sources Its Newest Hardware, the Time Appliance Project

The Time Appliance Project (TAP) is Facebook’s newest sub-microsecond network time synchronization system. Designed to enhance data centers, it is open-source, well documented, and ready to review.

October 08, 2021 by Adrian Gibbons

Siemens Unleashes mPower: A Power Integrity Toolset for EM and IR Analysis

A new software solution from Siemens is helping designers combat power integrity issues caused by electromigration and voltage drops. Let's dive into the issues the new tool called "mPower" is hoping to solve.

September 28, 2021 by Jake Hertz

Update HDL Code in Space From Earth? ST and Xilinx Team Up for Rad-hard FPGAs

The race for space has created a flood of innovations in space-rated tech. Hoping to strike gold with updatable FPGAs, Xilinx and STMicroelectronics have teamed up for a rad-hard solution.

August 26, 2021 by Jake Hertz

Entering the Era of AI IC Design: Where Do EEs Fit In?

As AI automated design becomes more and more prevalent in IC design, what are the impacts on the everyday EE?

June 25, 2021 by Jake Hertz

Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?

April 18, 2021 by Jake Hertz

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.

April 14, 2021 by Antonio Anzaldua Jr.

New Tool from UnitedSiC Aims to Simplify the Increasingly Confusing Transistor Landscape

A new component selection tool from UnitedSiC aims to make the design of SiC-based applications more straightforward and economical.

March 27, 2021 by Jake Hertz

Boosting Memory Performance in the Age of DDR5: An Intro to DDR Training Modes

Analysts predict that DDR5 will dominate the DRAM market in coming years. How do you calibrate DDR for peak memory performance?

November 06, 2020 by Dr. Steve Arar

Synopsys, Cadence, and Agnisys Release Major Platform Updates to EDA Tools

This summer, three major EDA companies have ramped up their software tools to better assist IC designers.

October 19, 2020 by Jake Hertz

The Evolution of SPICE Continues With PSPICE for TI

The new PSPICE for TI enables engineers to simulate complex analog circuits with unlimited analysis of TI power and signal-chain products.

September 17, 2020 by Jake Hertz

In-Mold Electronics Processes Show Promising Results for Speedy 3D-Shaped Design Development

In-mold electronic devices will emerge as a significant trend in electronic manufacturing.

July 16, 2020 by Gary Elinoff

Aesthetics vs. Functionality in Circuit Design? In-Mold Electronics Eliminates the Tradeoff

An emerging field in electronics manufacturing may provide lightweight and cost-effective solutions to meet design constraints. But it's not without drawbacks.

July 15, 2020 by Jake Hertz

Advancing Future Flexible Wearable Electronics Through Liquid Metal Synthesis

Research aims to harness the piezoelectric properties of unique ultra-thin materials.

July 13, 2020 by Gary Elinoff

IC Designers Now Have a Platform to Design Chips in the Cloud

Samsung Electronics, in collaboration with Rescale, has just announced the launch of the Samsung Advanced Foundry Ecosystem (SAFE) Cloud Design Platform (CDP).

June 22, 2020 by Jake Hertz

What Do You Do When Your Design Gets Set Back by a Part’s End-of-Life Notice?

Getting an end-of-life notice on a component can be a major setback for both new and existing designs. How do you work around the inconvenience?

June 15, 2020 by Nicholas St. John

Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing

A new project indicates the value of 3D printing in PCB design: fast prototyping.

May 22, 2020 by Gary Elinoff

MATLAB and Simulink Get a Major Deep Learning Facelift

MathWorks has revamped MATLAB and Simulink with a host of deep learning development tools—and they say these updates will be a major boon for automotive and wireless designers.

May 09, 2020 by Robin Mitchell

Altium’s New Collaborative Platform Said to Slash the Lofty Price Tag on Design Miscommunication

There's a high price to pay when electrical engineers and mechanical engineers miscommunicate. Altium's new collaborative platform, Altium 365, may help.

May 07, 2020 by Robin Mitchell