Latest Mobile News

The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled…

The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.

Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to…

Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to support HMI and IoT edge applications.

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at…

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for…

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next…

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.

Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.

Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.

Announced today, the Aurora and Polaris development kits enable designs for the company’s studio-grade optical MEMS microphone.

Announced today, the Aurora and Polaris development kits enable designs for the company’s studio-grade optical MEMS microphone.

The dual launch places Snapdragon at the center of AI-focused mobile and PC experiences.

The dual launch places Snapdragon at the center of AI-focused mobile and PC experiences.

Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.

Announced today, SiTime is expanding into a $4 billion resonator market with its Titan platform.

Nexperia has introduced two programmable USB Type-C power delivery controllers and new ESD protection diodes for…

Nexperia has introduced two programmable USB Type-C power delivery controllers and new ESD protection diodes for high-speed applications exceeding 10 GHz.

In this roundup, we spotlight small, medium, and large antenna announcements fortifying communication across industries,…

In this roundup, we spotlight small, medium, and large antenna announcements fortifying communication across industries, from drones to satellites.

New AI upscaling tech points to a 2026 mobile graphics future driven by on-chip inference.

New AI upscaling tech points to a 2026 mobile graphics future driven by on-chip inference.

The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.

The new power MOSFET offers low ON-resistances combined with a compact 2.0 mm × 2.0 mm package.

With its E1 processor announced today, Efficient Computer is hoping to usher in a new era of general-purpose computing efficiency.

With its E1 processor announced today, Efficient Computer is hoping to usher in a new era of general-purpose computing efficiency.

Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.

Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.

Sony, Omnivision, and Georgia Tech have each developed compact sensors that deliver high-end performance in tight spaces.

Sony, Omnivision, and Georgia Tech have each developed compact sensors that deliver high-end performance in tight spaces.

Keysight's new solution tackles LPDDR6 workflows for end-to-end memory design and testing.

Keysight's new solution tackles LPDDR6 workflows for end-to-end memory design and testing.

AI took center stage at CES 2025, with Intel showcasing its leadership through new Core and Core Ultra processors…

AI took center stage at CES 2025, with Intel showcasing its leadership through new Core and Core Ultra processors designed for AI-driven tasks.