The new hardware-assisted verification and validation system marks a first for the EDA industry.
February 21, 2024 by Jake Hertz
In this news analysis piece, Nathatisi examines the details of the Bluetooth SIG’s Electronic Shelf Label (ESL) standard and explores its significance.
February 20, 2024 by Nthatisi Hlapisi
The analyzer's package-on-package interposer design enables shorter cables and active probing with measurements at 8,533 MT/s or more.
February 15, 2024 by Duane Benson
Slated for commercial launch in 2030, 6G wireless technology is progressing in labs and conferences around the world.
January 31, 2024 by Jake Hertz
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.
January 17, 2024 by Duane Benson
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing applications.
January 15, 2024 by Aaron Carman
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of connected devices.
January 13, 2024 by Jake Hertz
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.
January 09, 2024 by Duane Benson
While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.
December 27, 2023 by Jeff Child
Intel's new Core Ultra mobile processors and 5th Gen Xeon processors build in AI acceleration with specialized cores, marking the biggest architectural change since the 80286.
December 19, 2023 by Duane Benson
At 1 mm x 5 mm, the new passive is the first of its kind designed for size-constrained Wi-Fi 6E and Wi-Fi 7 products.
December 15, 2023 by Duane Benson
High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and extend operating times for battery-powered devices and systems.
December 11, 2023 by Mike Falter
As we look back on 2023, we give tribute to the 50th anniversary of the cellphone. After half a century, this device is almost unrecognizable from its two-pound form in the 70s and 80s.
December 11, 2023 by Aaron Carman
Packing a radar and UWB transceiver in one chip, NXP’s latest development, announced today, simplifies vehicle access.
November 28, 2023 by Aaron Carman
Employing an ultrasound technique, xMEMS Labs has created a powerful MEMS speaker with a broad frequency range for next-gen applications.
November 14, 2023 by Aaron Carman
SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.
October 16, 2023 by Jake Hertz
The Keysight EDA 2024 tool suite promises to provide end-to-end design, modeling. and simulation with “shift left” workflow tools designed to increase productivity in the RF/5G world.
September 30, 2023 by Duane Benson
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
September 25, 2023 by Duane Benson
It’s a consequential time in the connectivity world. While Apple switches to USB-C on its new iPhone 15, Intel has released version 5 of its Thunderbolt standard.
September 21, 2023 by Jake Hertz
The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.
September 19, 2023 by Aaron Carman
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