Packing a radar and UWB transceiver in one chip, NXP’s latest development, announced today, simplifies vehicle access.
November 28, 2023 by Aaron Carman
Employing an ultrasound technique, xMEMS Labs has created a powerful MEMS speaker with a broad frequency range for next-gen applications.
November 14, 2023 by Aaron Carman
SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.
October 16, 2023 by Jake Hertz
The Keysight EDA 2024 tool suite promises to provide end-to-end design, modeling. and simulation with “shift left” workflow tools designed to increase productivity in the RF/5G world.
September 30, 2023 by Duane Benson
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
September 25, 2023 by Duane Benson
It’s a consequential time in the connectivity world. While Apple switches to USB-C on its new iPhone 15, Intel has released version 5 of its Thunderbolt standard.
September 21, 2023 by Jake Hertz
The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.
September 19, 2023 by Aaron Carman
Using modified quantum dot technology, Saphlux says its new display prototype offers the best red micro-LED engine in the industry.
August 23, 2023 by Jake Hertz
Aimed at easing the process of developing devices that require HD haptics, Titan Haptics has unveiled a tiny board designed both for development and and for embedding into your design.
August 02, 2023 by Jeff Child
Claimed to be the first of its kind, the StatIQ Band from Iona Tech continuously monitors body voltage to prevent ESD events on electronics manufacturing floors.
July 18, 2023 by Jake Hertz
With a wearable projector that acts as a "non-physical smartphone," Humane hopes its flagship computing device will help people stay present in everyday life.
July 11, 2023 by Chantelle Dubois
Launched here today, Titan’s clustered array motor approach enables engineers to combine multiple haptic motors into an array that meets their exact application needs.
June 20, 2023 by Jeff Child
A new SoC from Silicon Labs supports multiple protocols and is optimized for Amazon Sidewalk.
June 12, 2023 by Jake Hertz
Apple’s mixed-reality headset offers a plethora of technological innovations, including a new SoC that prevents users from experiencing nausea while wearing the headset.
June 07, 2023 by Jake Hertz
Arm's latest Total Compute Solutions includes an updated suite of CPU, GPU, system, and software IP for mobile computing.
June 05, 2023 by Chantelle Dubois
Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).
May 31, 2023 by Jake Hertz
Despite Apple’s internal efforts, the company still needs to rely on third parties for wireless chips.
May 24, 2023 by Jake Hertz
The new solution helps to control the temperature rise in electronic equipment.
May 19, 2023 by Jake Hertz
Nordic Semiconductor and IoT software company Onomondo have teamed up to eliminate traditional hardware-based SIM cards for 4G and 5G designs.
May 16, 2023 by Jake Hertz
Released in time for PCIM Europe this week, the new chip's integrated approach is aimed at enabling easier and more-cost-efficient wireless charging designs.
May 08, 2023 by Jake Hertz
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