iDEAL Semiconductor co-founder David Jauregui outlines how the silicon SuperQ architecture can challenge SiC and GaN in power electronics and leverage silicon's…
iDEAL Semiconductor co-founder David Jauregui outlines how the silicon SuperQ architecture can challenge SiC and GaN in power electronics and leverage silicon's infrastructure lead.
After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle…
After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle full-stack AI silicon, 2.5D packaging, and co-packaged optics.
The Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 are the first mobile SoCs to break the 5 GHz barrier, while…
The Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 are the first mobile SoCs to break the 5 GHz barrier, while Snapdragon Sound Elite Gen 2 targets camera-equipped AI wearables.
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end…
The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end compute and proactive mobile intelligence.
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
New chip weds advanced technology from Nuvoton and Klippel to create a high-performance audio solution for smart audio devices
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF…
The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's…
The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.
The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.
The 33-mm, coin-cell-powered board includes dual antennas, multiprotocol wireless support, and an integrated sensor suite.
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing…
Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.
Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.
Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled…
The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.
Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to…
Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to support HMI and IoT edge applications.
Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at…
Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.
Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for…
Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.
Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next…
Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.
Announced today, the Aurora and Polaris development kits enable designs for the company’s studio-grade optical MEMS microphone.
Announced today, the Aurora and Polaris development kits enable designs for the company’s studio-grade optical MEMS microphone.
The dual launch places Snapdragon at the center of AI-focused mobile and PC experiences.
The dual launch places Snapdragon at the center of AI-focused mobile and PC experiences.
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