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ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child
France’s Drive to Rebuild a Native Semiconductor Industry

France’s Drive to Rebuild a Native Semiconductor Industry

France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.


News Jun 11, 2026 by Gordon Feller
Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Paragraf Unwraps Graphene-Based FET Made at New Graphene Foundry

Paragraf Unwraps Graphene-Based FET Made at New Graphene Foundry

Paragraf recently introduced a new GFET, a next-generation graphene transistor platform designed for scalable molecular sensing and research applications.


News May 29, 2026 by Joshua Tidwell
U-blox Spans ADAS L2+ to L4 With Two Automotive GNSS Modules

U-blox Spans ADAS L2+ to L4 With Two Automotive GNSS Modules

U-blox has introduced the ZED-X20K and ZED-A20K GNSS modules for ADAS and autonomous vehicles, targeting scalable positioning and functional safety needs.


News May 26, 2026 by Joshua Tidwell
STMicro Unwraps Low-Power Image Sensors for Always-On Designs

STMicro Unwraps Low-Power Image Sensors for Always-On Designs

New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.


News May 07, 2026 by Jake Hertz
TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.


News May 05, 2026 by Duane Benson
Toshiba Collapses MCU, Motor Driver, and Sensorless Control Into One IC

Toshiba Collapses MCU, Motor Driver, and Sensorless Control Into One IC

The new motor control device simplifies high-efficiency brushless DC systems by combining a 32-bit processor with a specialized hardware vector engine.


News May 04, 2026 by Jake Hertz
Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

The new ADAA245x series increases bandwidth by 400 percent and introduces Ethernet tunneling for software-defined vehicles.


News May 01, 2026 by Jake Hertz
Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

The company’s latest silicon, silicon carbide, and gallium nitride solutions offer a complete power conversion chain from the grid to the processor for AI data centers.


News Apr 16, 2026 by Jake Hertz
Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.


News Apr 15, 2026 by Joshua Tidwell
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.


News Apr 10, 2026 by Gordon Feller
U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables, fleet trackers, and drones.


News Mar 26, 2026 by Luke James
STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.


News Mar 23, 2026 by Jake Hertz
Research Shorts: Medtech Targets Sleep, Speech, Strength, and More

Research Shorts: Medtech Targets Sleep, Speech, Strength, and More

Recent research explores healthcare diagnosis, monitoring, and rehab—from the "world's smallest programmable microbots" to wearables that restore speech to stroke patients.


News Feb 16, 2026 by Austin Futrell
Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

The new linear sensor pushes the capture speed envelope for industrial machine vision.


News Feb 13, 2026 by Duane Benson
Toshiba Intros High-Speed Comparator for Industrial Safety

Toshiba Intros High-Speed Comparator for Industrial Safety

Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for safer overcurrent detection.


News Jan 29, 2026 by Joshua Tidwell
Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.


News Jan 19, 2026 by Jake Hertz
TDK Merges Sensing and Intelligence at the Edge Like Never Before

TDK Merges Sensing and Intelligence at the Edge Like Never Before

All About Circuits met with TDK at CES 2026 to learn how their solutions may redefine sensing, inference, and context awareness in wearables and smart glasses.


News Jan 19, 2026 by Jake Hertz