SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.
January 09, 2020 by Tyler Charboneau
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
January 08, 2020 by Gary Elinoff
Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home security devices.
January 06, 2020 by Gary Elinoff
The TouchPoint ultrasound sensor utilizes sound waves to turn any surface into a touchscreen, eliminating the need for physical buttons.
January 03, 2020 by Cabe Atwell
Recently, scientists have successfully paired quantum particle technology with nano-scale circuitry.
January 01, 2020 by Tyler Charboneau
Flex Logix’s eFPGA is a low-power FPGA that can be integrated into SoCs, microcontrollers, and ICs.
December 18, 2019 by Cabe Atwell
The Core-V Chassis evaluation SoC will feature a CV64A 64-bit core and a CV32E 32-bit coprocessor core as well as 3D and 2D GPUs.
December 13, 2019 by Cabe Atwell
Microchip's new RISC-V-based PolarFire SoC family is said to provide 50% lower power than competing mid-range FPGAs.
December 10, 2019 by Lisa Boneta
Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.
December 09, 2019 by Gary Elinoff
Groq, a semiconductor startup with software roots, has developed a new processing unit with a unique architecture that offers inference solutions for AI acceleration.
December 03, 2019 by Majeed Ahmad
The new 7nm SoC is the first device in a chipset family offering integrated 5G modems.
December 03, 2019 by Gary Elinoff
These recently-released FPGAs aim to use accessible programming languages, withstand harsh environments, and support ASIC prototyping.
November 23, 2019 by Robin Mitchell
Dialog Semiconductor today announced a new BLE SoC—one it claims is the smallest and least power-hungry on the market.
November 04, 2019 by Robin Mitchell
The die-to-die PHY IP enables extra-short reach connectivity in multi-chip modules (MCM) for hyper-scale data centers, AI, and networking applications.
November 01, 2019 by Lisa Boneta
Robust NVM (non-volatile memory) can now more easily co-exist with power functions on the same chip.
October 18, 2019 by Gary Elinoff
NSITEXE utilizes Synopsys’ development tools and IP to build a SoC (system-on-a-chip) for autonomous driving.
September 09, 2019 by Gary Elinoff
Nissan has adopted Renesas's R-Car SOC and RH850 MCU for its ProPilot2 driver assistance system.
August 08, 2019 by Gary Elinoff
Maxim claims their newest temperature sensor and heart-rate monitor are "lowest-power" with clinical-grade accuracy.
July 30, 2019 by Gary Elinoff
What makes a secure SoC actually... secure? Check out this overview of hardware-based security features in a real-world example IC.
July 24, 2019 by Mark Hughes
A new tool from foundry group X-FAB aims to mitigate the negative effects of substrate coupling in IC design.
May 13, 2019 by Gary Elinoff
Available in ultra-thin QFN (UQFN) packages, the new devices measure at 3mm x 3mm x 0.65mm.
18 hours ago by Gary Elinoff
BOXiedge is a 24-core mini-server driven by an SoC clocked at 1GHz. What about this solution speaks to the trend toward edge computing?
one day ago by Robin Mitchell
The SZ1101 (33W) and SZ1105 (65W) incorporate four key ACF subsystems to simply design and reduce BOM count.
one day ago by Gary Elinoff
Based on familiar COTS devices, these two radiation-hardened devices are designed to facilitate space-based Ethernet connectivity.
2 days ago by Gary Elinoff
Renesas’ ISL91301B PMIC is featured in Google’s Coral devices, including the Mini PCIe Accelerator, M.2 Accelerator, and SoM.
2 days ago by Cabe Atwell
The ML100E series offers 41 standard models with varying VDC inputs and output ranges along with short circuit protection and a wide range of temperature tolerances.
Qorvo claims that ACT475M is the industry’s first AEC-Q100-qualified PMIC DC-DC buck converter aimed at USB Type-C fast charging applications.
3 days ago by Gary Elinoff
The TMC7300 can deliver two amps to drive either one or two DC motors, relays, and LEDs.
4 days ago by Gary Elinoff
CES 2020 offered new insights and product announcements regarding 5G, automotive, IoT, and AI. But which of these trends should engineers pay attention to?
4 days ago by Lisa Boneta
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.
4 days ago by Cabe Atwell
Whether we like it or not, electrical engineers are deeply implicated in the world’s confusing and expensive quest for quality of life.
5 days ago by Robert Keim
This article reviews how AI is making its way into education, which in turn may direct the future of Industry 4.0.
January 11, 2020 by Cabe Atwell
Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.
January 10, 2020 by Gary Elinoff
The new power management IC is said to help designers build smaller, less intrusive automotive camera systems.
January 09, 2020 by Gary Elinoff
The OpenRTK330L is said to deliver cm-level accuracy during GNSS outages and is fully customizable with open-source algorithms.
January 08, 2020 by Lisa Boneta
Micron claims that the new DDR5 will provide an 85% increase in memory performance in the next generation of server workloads.
January 07, 2020 by Lisa Boneta
NXP designed S32G, a vehicle network processor, to reduce software complexity and enhance data security.
January 07, 2020 by Gary Elinoff
CES isn't just for consumer gadgets. Here are some trends at the show that may affect your designs.
January 07, 2020 by Hannah DeTavis
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