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Intel’s Latest Roadmap Shakes Up Past Plans and Ditches Node Nomenclature

Meeting goals sometimes means adjusting and overhauling the original plan. From new technology to updated nomenclature, Intel is trying to do just that with its latest up-to-date roadmap.

3 days ago by Jake Hertz

New IEEE Standard Takes Aim at Easing Long-Reach SerDes Automotive Design

Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.

July 15, 2021 by Adrian Gibbons

Higher Memory, Compute, and Security: Xilinx’s Versal HBM Platform Speeds Past DDR5

Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.

July 14, 2021 by Adrian Gibbons

TI’s Sitara AM2x Platform Blurs the Lines Between MCU and MPU

Recently, All About Circuits had the chance to talk with Texas Instruments about its newest MCU development, the Sitara AM2x.

July 12, 2021 by Jake Hertz

From Safety to Design Simplification: IoT Design Takes Another Leap Forward

Recently IoT has been at the forefront of everyone's mind, especially for Renesas, Silicon Labs, and Nordic Semiconductor. What IoT innovations have they come up with lately?

July 09, 2021 by Jake Hertz

Qualcomm’s 5G Open RAN Platform Elevates 5G Small Cell Technology

Small cell technology is becoming increasingly important as 5G continues its rollout, but why is that and what role is Qualcomm taking?

July 08, 2021 by Jake Hertz

Marvell’s OCTEON 10: The First DPU To Use Neoverse N2 ARMv9 Architecture

Marvell’s newest 5 nm data processing unit (DPU), the OCTEON 10, offers 3x improvement over the previous generation along with the newest ARMv9 Core.

July 07, 2021 by Adrian Gibbons

The Story of Bluetooth: The Slow Road to Becoming an Industry Standard

Bluetooth seems like a commonplace technology in 2021; however, this wasn't always the case. What did the slow adoption of this industry-standard technology look like?

July 03, 2021 by Lianne Frith

Design Tips for Protecting High-Speed Interfaces

In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.

June 29, 2021 by Todd Phillips

IBM Accelerates Germany as a Quantum Hub with EU’s First Quantum Computer

Quantum computing momentum just got faster with the EU's first quantum computer: IBM's "Quantum System One." What could this computer mean for the EU, quantum technology, and Germany?

June 24, 2021 by Tyler Charboneau

Examining the Negative Resistance of a Quartz Crystal Oscillator

This article discusses how we can examine the oscillator circuit to make sure that it has sufficient “negative resistance” or “oscillation allowance”.

June 18, 2021 by Steve Arar

A “Shelf-life” for FinFETs? Samsung and TSMC Improve Node Density for RF

Single-digit node process is nothing new, but existing technology hampers RF performance due to parasitics. Samsung Foundry and TSMC seek to bring single-digit node performance to RF chips.

June 17, 2021 by Adrian Gibbons

Easing the Effort: Mipsology Accelerates ML with Zebra FPGA IP

Today, Mipsology is announcing its solution for FPGA programming: Zebra FPGA IP. This IP aims to ease FPGA programming, giving the designer more time to design.

June 09, 2021 by Sam Holland

“Smart” Power Lines? ST’s SoC and RF Chipset Get Industry-first Certification

The G3-PLC hybrid standard ensures interoperability and is key to STMicroelectronics delivering competitive market solutions for power line communications.

June 03, 2021 by Adrian Gibbons

NXP is Revving Up ADAS Technology with 16 nm FinFET Processors

Recently, AAC had the chance to sit down with Matthias Feulner and Brian Carlson from NXP to hear about two new automotive processors on 16nm technology.

June 02, 2021 by Jake Hertz

Concrete Batteries: Cementing a New Foundation for Energy Storage?

In a newly published paper, researchers from Chalmers University describe how they were able to turn cement into a medium for electrical energy storage.

May 28, 2021 by Jake Hertz

Qualcomm Aims for a Wireless Industry with 5G IIoT Chipset

This week All About Circuits had the chance to sit down with Qualcomm and talk about its newest chipset for IIoT and how it is moving 5G to industrial settings.

May 21, 2021 by Jake Hertz

Protecting Power Over Ethernet (PoE / PoE++) Communications

This article is the first in the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series from Littelfuse.

April 14, 2021 by Todd Phillips

Google Hires Intel CPU Expert, Doubles Down on SoCs as the “New Motherboard”

Intel veteran Uri Frank has been hired by Google as its new VP of engineering for server chip design. What does this mean for Google's custom silicon?

March 24, 2021 by Jake Hertz

AMD Says Its “Highest-performing Server Processor” Is Here

Designed to level up with burgeoning data center demands, AMD claims its new EPYC 7003 Series CPUs outperform competitors in terms of speed and security.

March 16, 2021 by Jake Hertz