Leveraging integrated quantum photonics to solve secured quantum communication challenges, Nanjing University researchers exploit integrated single-photon detectors to enhance secure key rates in quantum communication.
3 days ago by Abdulwaliy Oyekunle
In this Industry Article, we'll discuss PoE (Power over Ethernet) standards and power sourcing equipment (PSE), using office Internet of Things (IoT) devices as an example application.
November 16, 2021 by Rich Fry, TDK Corporation of America
Wi-Fi HaLow is described as having the best combination of range, throughput, density, low-power operation, and deployment costs. Now, the certification program will bring this latest IEEE standard to market.
November 05, 2021 by Jake Hertz
Hoping to curb e-waste and let consumers have one cord to charge their devices, the European Commission (EC) suggests USB-C should become standard. How could this affect e-waste, designs, and engineers?
October 19, 2021 by Tyler Charboneau
Researchers and companies alike are investing time into quantum networks/internet. However, what is this technology, how is it secured with quantum key distribution, and what are TB Group and Toshiba creating?
October 18, 2021 by Abdulwaliy Oyekunle
The demand for better connectivity has prompted the shift to 112G PAM4, though there are many challenges like signal integrity. Taking on these challenges, Microchip unveils its latest solution.
September 09, 2021 by Jake Hertz
Hoping to take the "edge" off of data center workloads comes two new additions to Semtech's Tri-Edge family. What are they and how do they help data centers keep up through data center interconnects?
September 03, 2021 by Antonio Anzaldua Jr.
OT (operational technology) and IT (informational technology) may have different real-time needs, but they're merged in the TSN (time-sensitive networking) Ethernet-based standards. Learn about the theory and hardware involved in implementing TSN in industrial network design.
August 12, 2021 by Christian Castel, NXP
Direct physical interfaces between sensor and processor over long distances is a major challenge in automotive design. The IEEE 2977-2021 MIPI A-PHY specification might be the key to this challenge.
July 15, 2021 by Adrian Gibbons
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.
July 14, 2021 by Adrian Gibbons
