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Cisco Unveils ICs for AI Fabrics and Nvidia-Codeveloped USFP Optics Spec

Cisco Unveils ICs for AI Fabrics and Nvidia-Codeveloped USFP Optics Spec

Announced today at OCP Summit, Cisco and Nvidia have partnered on the open USFP optical spec, alongside new Cisco Silicon One ASICs and runtime security to scale next-generation Ethernet AI fabrics.


News 12 hours ago by Jeff Child
Understanding Pulse‑Amplitude Modulation: Natural‑Sampling Explained

Understanding Pulse‑Amplitude Modulation: Natural‑Sampling Explained

Multiplying a message by a pulse train replicates its spectrum at every harmonic. See why a 1/3 duty cycle and 4x oversampling stretch the bandwidth roughly 12-fold.


Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle full-stack AI silicon, 2.5D packaging, and co-packaged optics.


News Oct 07, 2026 by Dale Wilson
Amphenol RF 2.92mm Cable Assemblies | Digital Datasheet

Amphenol RF 2.92mm Cable Assemblies | Digital Datasheet

Amphenol RF 2.92mm Cable Assemblies provide reliable, high-frequency connectivity for demanding RF and microwave applications, supporting operation up to 40 GHz with low VSWR and insertion loss. Watch and learn all about their features, specs, applications, and more!


new products Sep 30, 2026 by Mouser
An RS-485 Pressure Sensor Interface Board Compatible with Arduino

An RS-485 Pressure Sensor Interface Board Compatible with Arduino

This project brief describes how to build and use an Arduino-compatible interface board that reads an on-board pressure sensor and reports the measurement over an RS-485 network.


Microchip Clock Buffers Bridge SoCs & FPGAs With Higher-Voltage Sources

Microchip Clock Buffers Bridge SoCs & FPGAs With Higher-Voltage Sources

The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,


News Sep 28, 2026 by Jake Hertz
An Arduino-Compatible Joystick Interface for RS-485 Motion Control

An Arduino-Compatible Joystick Interface for RS-485 Motion Control

This project brief describes how to build and use an Arduino-compatible interface board that reads a 2-axis thumb joystick and transmits its position over an RS-485 network.


An Arduino-Compatible Relay Controller for RS-485 Networks

An Arduino-Compatible Relay Controller for RS-485 Networks

This project brief describes how to build and use an Arduino-compatible relay interface board that switches a 10 A load over an RS-485 network.


Semtech Adds New Transceivers for ‘Complete Wireless IC Portfolio’

Semtech Adds New Transceivers for ‘Complete Wireless IC Portfolio’

The new members deliver fourth generation LoRa Plus IP-core compatible performance at less stringent tiers to complement flagship LR2021.


News Sep 14, 2026 by Duane Benson
Alif Semiconductor Unveils $49 StartKit Platform for Edge AI Development

Alif Semiconductor Unveils $49 StartKit Platform for Edge AI Development

The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated Ensemble and Balletto MCUs.


News Sep 09, 2026 by Jeff Child
Amphenol / SV Microwave U.FL-to-VITA Cable Assemblies | New Product Brief

Amphenol / SV Microwave U.FL-to-VITA Cable Assemblies | New Product Brief

Amphenol / SV Microwave U.FL-to-VITA Cable Assemblies, available from Mouser, provide compact, high-performance RF connectivity for dense VPX plug-in cards, embedded computing systems, and precision test environments. Watch and learn all about their features, specs, applications, and more!


new products Sep 08, 2026 by Mouser
How Does Miniaturization Influence Microwave Filter Performance?

How Does Miniaturization Influence Microwave Filter Performance?

Scaling down RF circuit footprints requires balancing board space against critical trade-offs. Discover how loading methods and high-dielectric substrates impact Q factor and insertion loss.


AMD to Bring UCIe Chiplet Connectivity to Versal RF Adaptive SoCs

AMD to Bring UCIe Chiplet Connectivity to Versal RF Adaptive SoCs

Select Versal RF Series devices will be AMD's first adaptive SoCs with native UCIe 1.1 interfaces, allowing designers to co-package third-party chiplets.


News Sep 03, 2026 by Luke James
Powering AI-RAN: How Telecom Power Architectures Must Evolve for the GPU Era

Powering AI-RAN: How Telecom Power Architectures Must Evolve for the GPU Era

Accelerator-based computing brings faster load changes, higher current density, and tighter thermal constraints, requiring updates to rectifiers, DC/DC conversion, and battery backup.


NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.


News Aug 25, 2026 by Jeff Child
Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.


News Aug 24, 2026 by Duane Benson
What’s Next in Wireless Communication? An Insider’s Perspective

What’s Next in Wireless Communication? An Insider’s Perspective

Joaquin Torrecilla, Keysight’s VP of Software Transformation, joins the show to discuss the evolution of wireless tech—from early Bluetooth to LEO satellite lasers, RedCap, and AI-native 6G.


Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.


News Aug 10, 2026 by Dale Wilson
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!


new products Aug 02, 2026 by Mouser