Latest EDA Tools Articles and Videos

Categories

Ep. 50 | AWS VP of Engineering Bill Vass on AI, Quantum Computing, and the Metaverse

Bill Vass of Amazon Web Services talks AI/ML, quantum computing, servers in space, the Metaverse, and how AWS wants to help engineers “just focus on being an engineer.”

July 19, 2022 by Daniel Bogdanoff

Siemens EDA Launches Revamped Mixed-signal IC Verification Platform

At this week’s Design Automation Conference (DAC), Siemens EDA rolled out a next generation version of its mixed-signal IC verification tool adding new capabilities.

July 12, 2022 by Jeff Child

Intel Joins With EDA Allies for On-demand Hardware on a Foundry Platform

IC design calls for advanced hardware and software. With Cloud Alliance, small companies can tap into trusted design environments and on-demand compute.

July 06, 2022 by Biljana Ognenova

Silicon Lifecycle Management: Enabling Silicon Visibility Through Intelligent Analysis

Learn about silicon lifecycle management (SLM), what it is, the EDA challenges involved, how it relates to SoC systems, and its overall benefits.

June 09, 2022 by Stephen Crosher and Steve Pateras, Synopsys

AMD SOM Kit Propels Robotics Beyond Custom Designs

Keen to free industrial robotics from the burdens of custom design, AMD has launched a SOM-based starter kit that puts ROS 2 and predefined interface apps into play.

May 17, 2022 by Jeff Child

The Pros and Cons of Moving EDA to the Cloud

Taking EDA to the cloud, Synopsys’ new software-as-a-service (SaaS) offerings for EDA and IC design raise the question: is cloud computing a good choice for chip design?

April 11, 2022 by Jake Hertz

GaN Keeps a Steady Pace Into 2022 With a Focus on Design

The race to beat out silicon (Si) for the "best" semiconductor continues with a rush of gallium nitride (GaN) announcements focusing on creating and furthering GaN-based device designs.

February 21, 2022 by Antonio Anzaldua Jr.

EU Officially Puts Forward Its Own Chips Act

The EU is following the U.S. in enacting its own chips act to stimulate the global semiconductor industry.

February 10, 2022 by Jake Hertz

From 5G Chipsets to Hardware Verification Platforms: SoC Design Ramps Up

As companies shoot to deliver higher performance devices, the system-on-a-chip (SoC) hopes to deliver. From new chipsets to SoC verification platforms, the industry aims to keep pushing SoCs to new heights.

February 03, 2022 by Abdulwaliy Oyekunle

With a New Factory on the Way, Nano Dimension Pushes for Widespread 3D-printed PCBs

Multi-layer PCBs are known for saving size and weight. Now, 3D printing these boards may be an option for more designers on a large scale.

February 02, 2022 by Lianne Frith

Altium Unveils the First “Design With Manufacturing” Platform

Announced at AltiumLive, the new Altimade application brings designers, supply chain experts, and manufacturers all on the same continuous digital thread.

January 27, 2022 by Jake Hertz

Hazards in Combinational Logic Circuits

This article covers undesired switching events, known as hazards, that can occur when developing combinational logic circuits.

December 30, 2021 by Dale Wilson

Combinational Logic Circuit Design and Simulation Using Gates

Gate-level implementation of logic functions is limited by the gate fan-in. This article examines logic factoring, grouping, and level increases to implement logic functions with limited input gates.

December 29, 2021 by Dale Wilson

Around the Industry: Examples of How Complex ICs Require Complex Design Tools

Industries like aerospace and defense are only raising the bar on IC requirements. Here are a few recently announced tools helping IC designers meet the task.

December 21, 2021 by Ikimi .O

IBM Quantum Summit 2021: QPU Eagle Breaks the 100-qubit Barrier

Building on year-over-year engineering advancements IBM unveils Eagle, a 127-qubit quantum processor, and the next generation of cloud-based quantum systems.

November 18, 2021 by Adrian Gibbons

High-layer Count (HLC) PCB Technology for the 5G Era

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.

November 11, 2021 by Sarah Kuang, Kinwong

Cadence’s HiFi 1 DSP Leverages New LC3 Codec for Improved Audio Systems

A new codec, LC3, included in Cadence's HiFi 1 DSP, is set to bring new features for designers to exploit in their Bluetooth Audio (LE Audio) profile applications, including Multi-Stream and Broadcast audio.

November 01, 2021 by Adrian Gibbons

Flux, a Google Doc-style Collaboration Tool for Hardware Design, Changes the Face of Remote Engineering

Inspired by GitHub, a new browser-based hardware development tool has recently raised $12M in funding.

October 14, 2021 by Jake Hertz

Cadence Releases First ECAD Platform Dedicated to 3D System Design

The Cadence Integrity 3D-IC platform brings together a suite of advanced floor planning and validation software to develop 3D-stacked SoC designs.

October 12, 2021 by Adrian Gibbons

Facebook Open-sources Its Newest Hardware, the Time Appliance Project

The Time Appliance Project (TAP) is Facebook’s newest sub-microsecond network time synchronization system. Designed to enhance data centers, it is open-source, well documented, and ready to review.

October 08, 2021 by Adrian Gibbons