Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.
November 03, 2022 by Edwin Robledo, Fusion 360 Electronics
Two industry-leading executives with electrical engineering backgrounds discuss some interesting results from their recent survey of design engineers and provide key insights from their positions in the electronics industry.
September 27, 2022 by Daniel Bogdanoff
This application note is a collaborative work between Cadence and Rohde & Schwarz and focuses on performance enhancements through linearization of non-linear devices as early as possible in the design process. Using an RF power amplifier (PA) as the reference, we discuss benefits which can be achieved with linearization techniques such as digital predistortion (DPD).
In partnership with Rohde & Schwarz
SkyWater CTO Steven Kosier explains how a US-based semiconductor foundry is innovating in the silicon world without chasing Moore’s Law scaling. This includes efforts in superconductors, quantum, photonics, biosensing, and heterogeneous integration.
September 13, 2022 by Daniel Bogdanoff
As companies shoot to deliver higher performance devices, the system-on-a-chip (SoC) hopes to deliver. From new chipsets to SoC verification platforms, the industry aims to keep pushing SoCs to new heights.
February 03, 2022 by Abdulwaliy Oyekunle
