With increased performance of drain-source on-state resistance, gate charge, and figures of merit, Infineon's latest 100 V MOSFET technology seeks to improve high-frequency switching applications.
November 21, 2021 by Ikimi .O
One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
November 11, 2021 by Sarah Kuang, Kinwong
Wi-Fi HaLow is described as having the best combination of range, throughput, density, low-power operation, and deployment costs. Now, the certification program will bring this latest IEEE standard to market.
November 05, 2021 by Jake Hertz
Amazon's Project Kuiper, a counterpart to SpaceX's Starlink, aims to bring connectivity to rural areas via a constellation of Ka-band satellites. Now, Verizon wants in on the action.
October 30, 2021 by Antonio Anzaldua Jr.
With large mergers like Renesas acquiring Dialog and Analog acquiring Maxim Integrated recently taking place, let's take a look at the effects of consolidating the semiconductor industry.
September 11, 2021 by Jake Hertz
The demand for better connectivity has prompted the shift to 112G PAM4, though there are many challenges like signal integrity. Taking on these challenges, Microchip unveils its latest solution.
September 09, 2021 by Jake Hertz
Multipath signals are generally considered an undesirable noise source in RF links. Flipping conventional thinking on its head, UC San Diego Researchers are capitalizing on two beams being better than one.
August 30, 2021 by Adrian Gibbons