Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
4 days ago by Duane Benson
The University of California researchers implanted 253 electrodes over the patient's speech center of the brain, intercepting signals that, if not for the stroke, would have gone to muscles in her lips, tongue, jaw, and larynx.
September 01, 2023 by Duane Benson
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
