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The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


Liquid Instruments Turns AI Prompts Into Customized Test Instruments

Liquid Instruments Turns AI Prompts Into Customized Test Instruments

The company's new, first-of-its-kind test software platform leverages AI to replace lengthy custom hardware or FPGA development.


News Jul 29, 2026 by Duane Benson
Keysight Intros High-Performance 4x100GE 1RU Cybersecurity Test Platform

Keysight Intros High-Performance 4x100GE 1RU Cybersecurity Test Platform

The new modular 1RU cybersecurity test platform, delivers 400 Gbps throughput for validating modern AI and hyperscale network infrastructure under heavy traffic demands.


News Jul 27, 2026 by Joshua Tidwell
Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.


News Jul 27, 2026 by Luke James
Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.


News Jul 24, 2026 by Luke James
4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

New HBM, UFS, NAND, and EEPROM devices span the storage stack.


News Jul 24, 2026 by Jake Hertz
AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.


News Jul 23, 2026 by Jeff Child
Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional multiphase limitations and drastically cut I²R thermal losses for high-demand loads.


News Jul 21, 2026 by Dale Wilson
Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.


Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering a full-flow agentic environment that boosts engineering productivity by 15X.


News Jul 15, 2026 by Jeff Child
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.


News Jul 13, 2026 by Austin Futrell
It’s Been a Busy Summer for Semiconductor Acquisitions

It’s Been a Busy Summer for Semiconductor Acquisitions

Four deals target edge AI hardware and software, data center cooling, and embedded development tools.


News Jul 10, 2026 by Luke James
AI Pipeline Storage Demands Optimal Performance, Efficiency

AI Pipeline Storage Demands Optimal Performance, Efficiency

Artificial intelligence data pipelines are placing new pressures on enterprise storage, and data centers must rapidly adapt storage capabilities with SSDs as their backbone.


Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.


News Jul 06, 2026 by Luke James
AI-Powered Compliance: Reducing Market Barriers for Electronics Manufacturers

AI-Powered Compliance: Reducing Market Barriers for Electronics Manufacturers

Learn how AI-powered compliance replaces manual, fragmented regulatory workflows with structured, automated data, dramatically lowering the cost of EU market entry for SMEs and manufacturers.


Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

OpenAI and Broadcom unveiled Jalapeño, OpenAI’s first custom AI accelerator designed from scratch for LLM inference, developed from initial design to tape-out in 9 months.


News Jul 01, 2026 by Jake Hertz
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child