Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
About 38 minutes ago by Duane Benson
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
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August 01, 2023 by Jeff Child