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Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI

At Computex, Intel described the CPU as the control plane for agentic workloads, pairing new processors and network controllers with fresh details on its inference GPU.


News Jun 05, 2026 by Luke James
Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

Nvidia Launches CPU for AI Agents, Claimed as 1.8x Faster Than x86 CPUs

The 88-core Vera processor introduces Spatial Multithreading and a claimed 1.8x task-completion lead over x86 processors.


News Jun 04, 2026 by Luke James
Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

Qualcomm Unwraps Products Bringing AI to Entry–Level Laptops and Robotics

At Computex 2026, the company is expanding its Edge AI ecosystem by introducing the Snapdragon C Platform for entry-level laptops, and the Dragonwing IQ10 Reference Design for robotics.


News Jun 01, 2026 by Jeff Child
Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis

The bottleneck limiting the next generation of artificial intelligence isn't compute power—it's the wire connecting the chips. French startup Scintil Photonics thinks it has the answer.


News May 29, 2026 by Gordon Feller
Enabling High-Performance AI PC Web Cameras Using eUSB2V2 Version of USB

Enabling High-Performance AI PC Web Cameras Using eUSB2V2 Version of USB

Learn how eUSB2V2-based enabling technology for next-generation AI PC web cameras delivers the high bandwidth, local intelligence, and power efficiency required for emerging edge AI use cases.


Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom Unveils Integrated Wi-Fi 8- and 50G PON Gateway-ICs for the AI Era

Broadcom’s high-integration Wi-Fi 8 & NPU-accelerated 50G PON gateway SoCs aim to build a cohesive, 50 Gbps broadband access ecosystem for the AI-infused home.


News May 27, 2026 by Jeff Child
The Cooling Problem That Could Bottleneck AI

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.


News May 20, 2026 by Gordon Feller
Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.


Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.


News May 12, 2026 by Luke James
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.


News May 11, 2026 by Jake Hertz
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Google Cloud split the TPU line into training and inference variants, with Arm Neoverse-based Axion CPUs as the host across the stack. Arm also rolled out Performix, a free performance toolkit aimed at the silicon's growing developer base.


News May 05, 2026 by Luke James
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


How Neuromorphic Chips are Revolutionizing the Edge

How Neuromorphic Chips are Revolutionizing the Edge

Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
Intel 8086: How a Stopgap CPU Became the Foundation of Modern Computing

Intel 8086: How a Stopgap CPU Became the Foundation of Modern Computing

Released in June 1978 after a three-month architecture sprint, the 8086 was meant to buy Intel time while it finished its real next-gen processor. But the real one failed, and the stopgap built x86.


News Apr 24, 2026 by Luke James
Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.


News Apr 15, 2026 by Joshua Tidwell
Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.


News Apr 09, 2026 by Luke James
EU’s European Investment Bank Meets the Unique Needs of Semiconductors

EU’s European Investment Bank Meets the Unique Needs of Semiconductors

Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.


News Apr 07, 2026 by Gordon Feller