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Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

About 38 minutes ago by Duane Benson

CPU Designer Jim Keller Rethinks RISC-V AI Processing at Tenstorrent

Hailed for his historic microprocessor designs at AMD, Apple, and Broadcom, Jim Keller is onto his next CPU endeavor at Tenstorrent.

September 19, 2023 by Jake Hertz

To Accelerate Edge Design, Cadence Introduces New NPUs and SDK to AI IP

The new NPUs offload from any host processor to facilitate on-device edge computing.

September 18, 2023 by Aaron Carman

Generative AI Startup Shows Off Digital In-Memory Computing Platform

Offering improved performance and lower operating costs, D-Matrix’s newest platform presents a clear path forward to scale data center AI.

September 14, 2023 by Aaron Carman

Memory, Processing, & Security: Focal Points of New Automotive Releases

Automotive developers seek new ways to up safety, functionality, and comfort in modern vehicles. These mobility products may help to meet such targets.

September 13, 2023 by Darshil Patel

How the 1969 AL1 Microprocessor Settled a Silicon Valley Court Drama

At the center of one of the largest early court cases in Silicon Valley was the AL1 device, the brainchild of Four-Phase Systems founder Lee Boysel.

September 07, 2023 by Jake Hertz

How Will Angstrom-Scale Chips Advance the Electronics Industry?

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).

August 31, 2023 by Rob Aitken, Synopsys

Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023

Intel’s newest Xeon processors are based on either performance cores (P-cores) or efficiency cores (E-cores), giving designers more flexibility to prioritize speed or power efficiency.

August 30, 2023 by Aaron Carman

AMD Levels Up Gaming GPUs, Providing Mid-Tier Option in RX 7000 Series

The two new graphics cards improve performance per dollar and fill an important gap in AMD's RX 7000 lineup.

August 29, 2023 by Aaron Carman

Qualcomm Reveals Snapdragon G Series Processors for Handheld Gaming

Qualcomm has a robust portfolio of computing solutions for gaming. Now, the company has released a new family of SoCs, broken into three tiers to meet different handheld gaming needs.

August 25, 2023 by Jake Hertz

Autonomous Robot Takes to the Soccer Field to Aim, Pass, and Score

To play a complex sport, this competitive robot uses multiple processors and local computer vision.

August 22, 2023 by Aaron Carman

Nvidia, Cadence, and Ceva Keep Up With AI Processing Demands

Each of these companies has introduced new hardware in the hopes of supporting modern AI workloads.

August 16, 2023 by Jake Hertz

Germany Dashes for the Lead in European Semiconductor Race

With a fresh injection of funds from the European Chips Act, Germany is vying to stabilize the European semiconductor industry within its borders.

August 15, 2023 by Duane Benson

IBM’s Analog AI Chip Takes New Approach to Mixed-signal Architecture

Combining the compute performance of analog with the flexibility of digital makes for a device uniquely suited to complex AI challenges.

August 14, 2023 by Aaron Carman

Understanding the Compute Hardware Behind Generative AI

Generative AI tools like ChatGPT have had a huge impact in numerous sectors of society. As engineers, it’s helpful for us to understand the computing technology that makes it possible.

August 10, 2023 by Steven Woo, Rambus

Hailo Debuts Two Additions to Hailo-8 AI Accelerator Portfolio

AI at the edge is now in reach for more designers, thanks to the newly-announced Hailo accelerator chips.

August 04, 2023 by Aaron Carman

Take Our 2023 EETech Global Engineering Survey

We’d like you to join your engineering community peers and take our EETech 2023 Global Engineering Survey. You’ll get a summary of the results once they’re released. Do it, and you’ll be entered for a chance to win an Amazon card prize!

August 01, 2023 by Jeff Child

Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.

July 12, 2023 by Jake Hertz

Ex-Apple Engineers Develop ‘Disappearing Computer’ in Pin-sized Device

With a wearable projector that acts as a "non-physical smartphone," Humane hopes its flagship computing device will help people stay present in everyday life.

July 11, 2023 by Chantelle Dubois

Lightelligence Reports ‘World’s First’ Optical Network-on-Chip Processor

The new processor is said to use optical networking to overcome scaling challenges in conventional computing architecture.

July 11, 2023 by Jake Hertz