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Samsung Shoots for High-performance Computing with 2.5D High-bandwidth Memory

Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.

one day ago by Adrian Gibbons

Single-chip Controllers Fuel the Ultra-wide Touchscreens Taking Over Dashboards

While capacitive touch sensors attract the spotlight in automotive touchscreen technology (and rightly so), single-chip controllers also warrant consideration for the ever-popular ultra-wide touchscreens in vehicles today.

April 22, 2021 by Adrian Gibbons

Cadence’s Recent Acquisitions Reveal Focus on Computational Fluid Dynamics

This year alone, Cadence has acquired both Pointwise and NUMECA, two companies specializing in multi-physics simulations and specifically computational fluid dynamics. How might this focus reflect Cadence's EDA strategy?

April 18, 2021 by Jake Hertz

Why Physical Verification Is Only Getting Tougher With Advanced Nodes

In the nanometer era, IC complexity grows faster than die areas. EDA companies are stepping up with tools to streamline physical verification.

April 14, 2021 by Antonio Anzaldua Jr.

Protecting Power Over Ethernet (PoE / PoE++) Communications

This article is the first in the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series from Littelfuse.

April 14, 2021 by Todd Phillips

Chip vs. PIFA: Selecting the Right Antenna for a Booming IoT Medical Industry

Amidst a burgeoning medical device market, choosing the correct IoT antenna means balancing competing requirements, including frequency of operation, PCB space, and cost.

April 05, 2021 by Adrian Gibbons

Texas Power Outages Illustrate the State’s Importance to the Semi Industry

The outages last month marked yet another setback to an industry that was already having serious trouble with meeting demand from automakers.

March 28, 2021 by Luke James

Four Lessons an Adult Engineer Can Learn From Children’s Toys

Children’s toys aren’t just for children. Inside every toy, there are hundreds of hours of engineering experience just waiting to be discovered.

March 24, 2021 by Mark Hughes

MIT Researchers Strike the Sweet Spot Between Fiber Optic and Copper Cabling

At just the width of a human hair, a new type of cable from MIT and Raytheon is said to be ten times faster than USB.

March 03, 2021 by Jake Hertz

The Race Toward Room-temperature Superconductors Heats Up

This month alone, multiple research institutions have flooded the press with news of a singular goal: to create room-temperature superconductors.

February 25, 2021 by Jake Hertz

Increased Funds Could Catalyze TSMC’s 3D IC Research

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.

February 22, 2021 by Luke James

PCB Layout Techniques for Reducing Harmonic Distortion of a Differential ADC Driver

Summary

February 19, 2021 by Steve Arar

iRel40: The European Initiative Determined to Improve Component Reliability

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.

February 17, 2021 by Luke James

Simplifying EV Power Design by Overcoming the Gate Driver Power Challenge

Power conversion systems in EVs follow the half-bridge configuration. This article explores the IGBT half-bridge design of a high-voltage side (output stage) of the gate driver.

February 16, 2021 by Charlie Ice, Silicon Labs

All About Seeing Your Projects: Optical and Digital Magnification

Smaller electronics call for more powerful inspection equipment. If you're building a collection of at-home lab equipment, these visual tools may help you see where you're going on minuscule boards.

February 14, 2021 by Mark Hughes

How to Use Decoupling Capacitor Placement to Reduce Harmonic Distortion

Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.

February 12, 2021 by Steve Arar

Nine Factors to Consider for Board-Level Machine Vision Camera Integration

Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.

February 11, 2021 by Brian Cha, FLIR

Understanding and Mitigating Motor Driver Board Parasitics through Simulation

This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.

February 04, 2021 by Matt Hein, Texas Instruments

As GaN Adoption Accelerates, an Industry Expert Offers Three Design Tips

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.

February 01, 2021 by Jake Hertz

Reducing Second Harmonic Distortion with Symmetrical PCB Layout

Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using symmetric PCB layout.

January 18, 2021 by Steve Arar