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The Race Toward Room-temperature Superconductors Heats Up

This month alone, multiple research institutions have flooded the press with news of a singular goal: to create room-temperature superconductors.

4 days ago by Jake Hertz

Increased Funds Could Catalyze TSMC’s 3D IC Research

The world’s biggest contract chipmaker recently reported its best-ever quarterly financials along with its goals for delving into 3D IC research.

February 22, 2021 by Luke James

PCB Layout Techniques for Reducing Harmonic Distortion of a Differential ADC Driver

Summary

February 19, 2021 by Steve Arar

iRel40: The European Initiative Determined to Improve Component Reliability

Europe-wide research initiative Intelligent Reliability 4.0 (iRel40), coordinated by Infineon, brings together 75 science, tech, and engineering partners from across 13 countries who are sharing resources to achieve this goal.

February 17, 2021 by Luke James

Simplifying EV Power Design by Overcoming the Gate Driver Power Challenge

Power conversion systems in EVs follow the half-bridge configuration. This article explores the IGBT half-bridge design of a high-voltage side (output stage) of the gate driver.

February 16, 2021 by Charlie Ice, Silicon Labs

All About Seeing Your Projects: Optical and Digital Magnification

Smaller electronics call for more powerful inspection equipment. If you're building a collection of at-home lab equipment, these visual tools may help you see where you're going on minuscule boards.

February 14, 2021 by Mark Hughes

How to Use Decoupling Capacitor Placement to Reduce Harmonic Distortion

Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.

February 12, 2021 by Steve Arar

Nine Factors to Consider for Board-Level Machine Vision Camera Integration

Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.

February 11, 2021 by Brian Cha, FLIR

Understanding and Mitigating Motor Driver Board Parasitics through Simulation

This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.

February 04, 2021 by Matt Hein, Texas Instruments

As GaN Adoption Accelerates, an Industry Expert Offers Three Design Tips

GaN FETs aren't a perfect drop-in for their silicon counterparts—without board-level modifications, that is. We spoke with Alex Lidow, CEO of Efficient Power Conversion, to get his advice on how to make the transition.

February 01, 2021 by Jake Hertz

Reducing Second Harmonic Distortion with Symmetrical PCB Layout

Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using symmetric PCB layout.

January 18, 2021 by Steve Arar

Introduction to Thermal Characterization Parameters

In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).

January 14, 2021 by Steve Arar

Tips for Achieving Low-Frequency Precision and Improved Bandwidth in Photodiode Circuits

This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.

January 13, 2021 by Robert Keim

Choosing the Right Redriver or Retimer Device to Extend PCIe Protocol Signal Range

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.  

January 12, 2021 by Tam Do, Microchip

Junction-to-Case Thermal Resistance in Thermal Design

Learn about an important thermal metric for designing the interface between an IC package and a heat sink.

December 30, 2020 by Steve Arar

Theta JA (θJA) Test Conditions for Assessing IC Package Thermal Design

Junction-to-ambient thermal resistance (or θJA) should be measured under standardized testing conditions. Learn about these details to use this thermal metric appropriately.

December 29, 2020 by Steve Arar

How Junction-to-Ambient Thermal Resistance of an IC Package Affects Thermal Performance

Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.

December 27, 2020 by Steve Arar

PCB Design Considerations When Using Bi-Directional Translators

In the past, we touched on the theoretical underpinnings of voltage-level translators. Now, we'll discuss some practical design tips for using these increasingly-common devices in your design.

December 11, 2020 by Nicholas St. John

What Is RF Integrated Circuit Design?

Learn the high-level steps behind RFIC design.

December 06, 2020 by Jean-Jacques DeLisle

What Is Analog IC Design?

Learn the basic steps of the analog IC design process and how it compares to digital IC design.

December 04, 2020 by Jean-Jacques DeLisle