This week, at the OCP Summit, Texas Instruments unveiled three new ICs designed to prevent power glitches, streamline high-voltage distribution, and minimize…
This week, at the OCP Summit, Texas Instruments unveiled three new ICs designed to prevent power glitches, streamline high-voltage distribution, and minimize signal jitter in AI data centers.
Intel, AMD, and Arm each made agentic AI announcements this week at OCP 2026, covering rack processor units, rack…
Intel, AMD, and Arm each made agentic AI announcements this week at OCP 2026, covering rack processor units, rack architecture, and benchmarking
Ross connects developers' preferred LLMs to AMD's Vivado and Vitis HLS toolchains through open-standard MCP servers.
Ross connects developers' preferred LLMs to AMD's Vivado and Vitis HLS toolchains through open-standard MCP servers.
The Edinburgh startup's Litavis chip unifies imaging, timing, and histogramming on a single device.
The Edinburgh startup's Litavis chip unifies imaging, timing, and histogramming on a single device.
The X7 runs on 2-5 W, connects over PCIe Gen 3 or USB 3.2, and uses the same CVflow engine already in over 50 million of…
The X7 runs on 2-5 W, connects over PCIe Gen 3 or USB 3.2, and uses the same CVflow engine already in over 50 million of the company’s AI SoCs.
Announced today at OCP Summit, Cisco and Nvidia have partnered on the open USFP optical spec, alongside new Cisco Silicon…
Announced today at OCP Summit, Cisco and Nvidia have partnered on the open USFP optical spec, alongside new Cisco Silicon One ASICs and runtime security to scale next-generation Ethernet AI fabrics.
The new QODN non-isolated Osprey bus converters offer high efficiency and compact footprints for demanding AI data center…
The new QODN non-isolated Osprey bus converters offer high efficiency and compact footprints for demanding AI data center and high-density compute applications.
The OAX7700 ASIC adds an NPU and pre-roll video capture to cut parking surveillance power consumption by 97%.
The OAX7700 ASIC adds an NPU and pre-roll video capture to cut parking surveillance power consumption by 97%.
Designing compact AI sensor nodes forces signal integrity and thermal management to compete for limited PCB copper,…
Designing compact AI sensor nodes forces signal integrity and thermal management to compete for limited PCB copper, creating severe PDN and thermal bottlenecks.
The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free…
The LSM6DSK320X and ISM6HGK256X combine low-g and high-g measurement in a 2.5 mm x 3 mm package using lead-free, BPA-free materials.
Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and…
Rambus' CryptoManager Root of Trust solution for Caliptra-based SoCs adds hardware security, attack protection, and lifecycle management for data center and AI chips.
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor…
In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The SY757xx family translates clock inputs from 1.2 to 3.3 V down to 1.2 V LVCMOS outputs at frequencies up to 250 MHz,
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
The new PSOC Control C3 product line focuses on secure, high-performance power conversion and motor control applications.
Learn how EPC’s multi-stage ISOP architecture uses low-voltage GaN FETs to efficiently convert 800 V DC in AI data…
Learn how EPC’s multi-stage ISOP architecture uses low-voltage GaN FETs to efficiently convert 800 V DC in AI data centers, reducing output ripple and capacitance while achieving up to 98.5% efficiency.
Recent semiconductor business moves from Nvidia, MediaTek, GlobalFoundries, Qualcomm, Amazon, and Analog Devices…
Recent semiconductor business moves from Nvidia, MediaTek, GlobalFoundries, Qualcomm, Amazon, and Analog Devices highlight growing investment in AI infrastructure, quantum manufacturing, optical connectivity, and edge intelligence.
Announced today by AtlasBase, Thalia is a 5.6B-well bio-silicon chip that uses synthetic DNA to break power and density…
Announced today by AtlasBase, Thalia is a 5.6B-well bio-silicon chip that uses synthetic DNA to break power and density bottlenecks in AI data center storage and molecular computing.
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring…
Announced today, MediaTek's new 3 nm Dimensity CX C10 Max SoC features an all-big-core Arm CPU and NPU 890 to bring flagship AI performance to fanless Googlebooks.
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive…
New T&M tools from Rohde & Schwarz, Tektronix, and Teradyne target packaged-goods inspection, HDMI and automotive compliance testing, and advanced AI semiconductor testing.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
Facebook
Google
GitHub
Linkedin