One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
November 11, 2021 by Sarah Kuang, Kinwong
The demand for better connectivity has prompted the shift to 112G PAM4, though there are many challenges like signal integrity. Taking on these challenges, Microchip unveils its latest solution.
September 09, 2021 by Jake Hertz
Working closely with ROHM Semiconductor, researchers at Osaka University have developed a device that operates in the terahertz spectrum to transmit large, uncompressed 8K videos uninterrupted within a 300 GHz bandwidth.
February 09, 2021 by Antonio Anzaldua Jr.