Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and built-in peripherals for secure IoT and…
Toshiba’s M4V Group MCUs combine an Arm Cortex-M4 core, layered security, integrated memory, motor control support, and built-in peripherals for secure IoT and industrial system control.
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle…
Nanopower Semiconductor’s power-saving IC manages sensors and peripherals while keeping the host MCU off, with an idle current of just 200 nA.
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP…
By embedding heterogeneous Si, SiC, and GaN die directly into 12-inch silicon wafers with precision RDLs, Onsemi's EPP replaces wire bonds and mold compounds to deliver up to 5x power density.
This project brief describes how to build and use an Arduino-compatible relay interface board that switches a 10 A load…
This project brief describes how to build and use an Arduino-compatible relay interface board that switches a 10 A load over an RS-485 network.
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the…
The Q-2390 and IQ-2390 share a Cortex-A78/A55 complex, an Adreno 704 GPU, and an optional RISC-V real-time core, with the industrial part introducing the IQ2 Series.
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated…
The new evaluation kits aim to lower the barrier for on-device AI development with Alif’s AI/ML hardware-accelerated Ensemble and Balletto MCUs.
Amphenol / SV Microwave U.FL-to-VITA Cable Assemblies, available from Mouser, provide compact, high-performance RF…
Amphenol / SV Microwave U.FL-to-VITA Cable Assemblies, available from Mouser, provide compact, high-performance RF connectivity for dense VPX plug-in cards, embedded computing systems, and precision test environments. Watch and learn all about their features, specs, applications, and more!
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4…
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI workloads across various domains.
Discover how the LT1079 quad op-amp minimizes sensor loading in battery-powered designs. Active cancellation and an…
Discover how the LT1079 quad op-amp minimizes sensor loading in battery-powered designs. Active cancellation and an onboard bridge network ensure maximum precision for resistive sensors.
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and…
The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless…
The rebuilt platform puts the previously closed cloud backend under an Apache 2.0 license and runs on AWS serverless services in a customer's own account.
As software-defined embedded systems evolve, dynamic storage architectures replace static partitioning to optimize flash…
As software-defined embedded systems evolve, dynamic storage architectures replace static partitioning to optimize flash efficiency, support long-term updates, and control rising hardware costs.
This project brief describes how to build and use an Arduino-compatible board that reads a linear Hall-effect sensor and…
This project brief describes how to build and use an Arduino-compatible board that reads a linear Hall-effect sensor and reports the measurement over an RS-485 bus.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health…
The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.
This article shows you how to configure Software Standby mode and implement a periodic wake-up routine on the Renesas…
This article shows you how to configure Software Standby mode and implement a periodic wake-up routine on the Renesas FPB-RA0E1 Fast Prototyping Board, built around the Arm Cortex-M23-based RA0E1 MCU.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect…
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!
On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency,…
On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs…
A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.
Facebook
Google
GitHub
Linkedin