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Siemens Upgrades Its AI Agent to Enable Self-Verifying Agentic AI EDA Workflows

Siemens Upgrades Its AI Agent to Enable Self-Verifying Agentic AI EDA Workflows

Siemens’ updated Fuse EDA AI Agent validates its own decisions against deterministic, physics-based EDA engines.


News Aug 03, 2026 by Jake Hertz
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!


The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.


News Jul 28, 2026 by Jeff Child
Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.


News Jul 24, 2026 by Luke James
Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


An Ultra-Low-Noise Pre-Amp For Audio Applications

An Ultra-Low-Noise Pre-Amp For Audio Applications

Build an ultra-low-noise preamplifier with a JFE150 JFET and OPA202 op-amp, perfect for high-impedance sensors, hydrophones, guitar pickups, microphones, and turntables.


Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.


News Jul 15, 2026 by Luke James
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Application Processors deliver intelligent, secure, and real-time edge computing for next-generation embedded systems. Watch and learn all about their features, specs, applications, and more!


AI Pipeline Storage Demands Optimal Performance, Efficiency

AI Pipeline Storage Demands Optimal Performance, Efficiency

Artificial intelligence data pipelines are placing new pressures on enterprise storage, and data centers must rapidly adapt storage capabilities with SSDs as their backbone.


OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
A Four-Channel RS-422 Differential Line Receiver Module

A Four-Channel RS-422 Differential Line Receiver Module

This project brief describes how to build and use a four-channel differential line receiver module for balanced RS-422 and RS-485 data links.


U-blox Unwraps Pair of Wi-Fi 6 Modules for Cost-Sensitive Designs

U-blox Unwraps Pair of Wi-Fi 6 Modules for Cost-Sensitive Designs

U-blox has introduced the MAYA-W5 and NORA-W5 Wi-Fi 6 module families for industrial and IoT applications, designed and manufactured in Europe.


News Jul 07, 2026 by Joshua Tidwell
Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

Nvidia First to Roll Out Full-Stack Safety System for Physical AI in Robotics

The full-stack platform pairs the IGX Thor compute module with a safety-certified software stack and an accredited inspection lab, with humanoid maker Agility as the first adopter.


News Jul 06, 2026 by Luke James
A Four-Channel RS-422 Differential Line Driver Module

A Four-Channel RS-422 Differential Line Driver Module

This project brief describes how to implement a four-channel differential line driver module for reliable long-distance data transmission over balanced twisted-pair lines.


Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.


News Jun 29, 2026 by Luke James
EPC Debuts Ultra-Compact GaN Motor Drive Reference Design

EPC Debuts Ultra-Compact GaN Motor Drive Reference Design

The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.


News Jun 26, 2026 by Jeff Child
ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

ST Unveils 2.3K-Zone dToF 3D Lidar Module for Resource-Limited Edge AI

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.


News Jun 22, 2026 by Jeff Child
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child