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IMEC and Diraq Tow the Quantum Line With Foundry-Compatible Spin Qubits

IMEC and Diraq Tow the Quantum Line With Foundry-Compatible Spin Qubits

The two research groups teamed up to demonstrate the first coherent operation of an eight-silicon-MOS spin-qubit array.


News Jul 31, 2026 by Duane Benson
The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.


News Jul 22, 2026 by Luke James
Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Application Processors deliver intelligent, secure, and real-time edge computing for next-generation embedded systems. Watch and learn all about their features, specs, applications, and more!


IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.


News Jul 13, 2026 by Austin Futrell
It’s Been a Busy Summer for Semiconductor Acquisitions

It’s Been a Busy Summer for Semiconductor Acquisitions

Four deals target edge AI hardware and software, data center cooling, and embedded development tools.


News Jul 10, 2026 by Luke James
OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
A Four-Channel RS-422 Differential Line Receiver Module

A Four-Channel RS-422 Differential Line Receiver Module

This project brief describes how to build and use a four-channel differential line receiver module for balanced RS-422 and RS-485 data links.


AI-Powered Compliance: Reducing Market Barriers for Electronics Manufacturers

AI-Powered Compliance: Reducing Market Barriers for Electronics Manufacturers

Learn how AI-powered compliance replaces manual, fragmented regulatory workflows with structured, automated data, dramatically lowering the cost of EU market entry for SMEs and manufacturers.


A Four-Channel RS-422 Differential Line Driver Module

A Four-Channel RS-422 Differential Line Driver Module

This project brief describes how to implement a four-channel differential line driver module for reliable long-distance data transmission over balanced twisted-pair lines.


Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

Meet Jalapeño: OpenAI and Broadcom’s Custom Chip to Power Future Models

OpenAI and Broadcom unveiled Jalapeño, OpenAI’s first custom AI accelerator designed from scratch for LLM inference, developed from initial design to tape-out in 9 months.


News Jul 01, 2026 by Jake Hertz
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

Indie Launches Edge AI SoC for Perception Systems in Autos and Robots

The new system-on-chip pairs a heterogeneous AI compute engine with a low-latency multi-camera image signal processor, and can ship pre-integrated with emotion3D perception software.


News Jun 29, 2026 by Luke James
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

Qualcomm Unveils Mixed-Reality Platform for AI-Driven Spatial Computing

The next-generation XR chipset delivers up to 48 TOPS of on-device AI and 4.4K-per-eye visuals. The device will debut this fall in XREAL's Project Aura glasses.


News Jun 25, 2026 by Luke James
Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum Unite for End-to-End IoT Interoperability

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.


News Jun 17, 2026 by Jeff Child
The Isolated Half-Bridge: An IGBT Gate Driver Module with Current Sense

The Isolated Half-Bridge: An IGBT Gate Driver Module with Current Sense

This project brief describes how to assemble an isolated half-bridge IGBT gate driver module built around the NCD57085DR2G. It features onboard current sensing and overcurrent protection.