As modulation scheme efficiency goes up, power amplifier efficiency goes down. Xilinx, TI, and Skyworks are bringing their expertise to the table to reconcile the trade-off.
November 18, 2020 by Adrian Gibbons
Xilinx solutions are surfacing for each new wave in the 5G rollout. Appearing in 2021, the new RFSoC DFE is forecasted to break all existing benchmarks.
October 27, 2020 by Adrian Gibbons
As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to save space and power.
October 26, 2020 by Steve Arar
With 5G closer than ever, it may be useful to brush up on the basics.
October 23, 2020 by John Koon
As 5G barrels forward, engineers are increasingly talking about one of the major design challenges of this technology: thermal management.
October 21, 2020 by Steve Arar
5G will operate at frequencies significantly faster than those of 4G, forcing PCB designers to rethink how their boards are designed and manufactured.
October 05, 2020 by Jake Hertz
NXP Semiconductors has announced the opening of its new high-volume RF GaN fab in Chandler, Arizona, representing the United States’ most advanced fab dedicated to 5G RF power amplifiers.
October 02, 2020 by Luke James
Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for FEC and HARQ line coding.
September 21, 2020 by Adrian Gibbons
This article outlines the attributes of both chip and PCB trace antennas. It also covers the design considerations required in selecting the right type of antenna to implement in your design.
In partnership with Dove Electronics
This article discusses the importance of an impedance-matched antenna when assembling for the end-user environment so that it operates in the desired frequency band with maximum efficiency.
Learn more about our new eSIM turnkey solution with pre-integrated connectivity for cellular-connected IoT devices.
In partnership with Infineon
Complementing the STM32 RF connectivity portfolio, the STM32WL System-On-Chip integrates both a general-purpose microcontroller and a sub-GHz radio on the same chip.
In partnership with STMicroelectronics
The new chip leverages photonic topological insulators to operate in the terahertz band—not in the 5G range, but in the 6G range.
August 10, 2020 by Jake Hertz
The two RF powerhouses have teamed up to create a flexible radio platform that addresses 5G network design challenges.
August 05, 2020 by Jake Hertz
The usable RF spectrum is a finite resource, and, with enough simultaneous users, congestion can become a serious impediment to reliable communication.
July 24, 2020 by Jake Hertz
Regarded the father of modern electronics, John Ambrose Flemings created the first vacuum tube while also providing some helpful educational tips now used in engineering education.
July 18, 2020 by Vanessa Samuel
A new connectivity protocol shows promise for IoT designs, rivaling LoRaWAN and NB-IoT.
July 07, 2020 by Tyler Charboneau
The most power-hungry component in RF transmitters, the RF power amplifier, is getting some serious attention from design engineers.
July 01, 2020 by Jake Hertz
Intel and AMD have historically been the leaders of data-intensive processors. But now, Ampere's Altra Max 128-core processor may beat out the two in managing data center workloads.
June 26, 2020 by Antonio Anzaldua Jr.
How exactly do error correction codes work and how do they affect the integrity of an MCU? A new ECC-protected Arm Cortex-M4F MCU from Maxim Integrated serves as a real-world example.
June 23, 2020 by Jake Hertz
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