The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.
The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive…
Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive accessory applications.
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.
Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle…
Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing…
An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic…
SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.
Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components…
Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver…
Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a…
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in…
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech,…
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech, such as HBM, amid global competition, US controls, and government support.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.
Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular…
Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular framework and configuration tool unification.
Memory selection has become a priority, as AI system designs demand more memory. Learn how to navigate hardware designs…
Memory selection has become a priority, as AI system designs demand more memory. Learn how to navigate hardware designs impacts and supply chain issues, and how BOM management tools help smooth the way.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.
MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn…
MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.
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