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Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.


Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
EU’s European Investment Bank Meets the Unique Needs of Semiconductors

EU’s European Investment Bank Meets the Unique Needs of Semiconductors

Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.


News Apr 07, 2026 by Gordon Feller
Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

In this article, Gordon posed a set of questions to TSMC about their next steps going forward.


News Jan 09, 2026 by Gordon Feller
Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Enjoy this roundup of our favorite All About Circuits research news articles of 2025!


News Dec 26, 2025 by Jeff Child
Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World

Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World

By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.


News Dec 15, 2025 by Gordon Feller
Korea’s Semiconductor Titans Undergo Strategic Transformations

Korea’s Semiconductor Titans Undergo Strategic Transformations

Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech, such as HBM, amid global competition, US controls, and government support.


News Dec 03, 2025 by Gordon Feller
GigaDevice Intros 32-MCU Family Sporting Arm Cortex-M33 Core, 1 MB Flash

GigaDevice Intros 32-MCU Family Sporting Arm Cortex-M33 Core, 1 MB Flash

The new Arm Cortex-M33 based GD32F503/505 family emphasizes memory flexibility, reliability, and security.


News Nov 07, 2025 by Duane Benson
Analog Devices Brings AI Workflow and Platform Unification to CodeFusion

Analog Devices Brings AI Workflow and Platform Unification to CodeFusion

Announced today, the launch of CodeFusion Studio 2.0 adds AI workflow and improved multicore support along with modular framework and configuration tool unification.


News Nov 03, 2025 by Duane Benson
AI’s Appetite for Memory: Can Hardware Designs Keep Pace?

AI’s Appetite for Memory: Can Hardware Designs Keep Pace?

Memory selection has become a priority, as AI system designs demand more memory. Learn how to navigate hardware designs impacts and supply chain issues, and how BOM management tools help smooth the way.


A Deep Dive on Winbond’s Memory Technology for Edge AI

A Deep Dive on Winbond’s Memory Technology for Edge AI

In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.


News Nov 13, 2024 by Jeff Child
Global Efforts Heat Up to Boost Semiconductor Production

Global Efforts Heat Up to Boost Semiconductor Production

Investments in semiconductor manufacturing have been on the rise in recent years. Here are a few new examples.


News Aug 22, 2024 by Jake Hertz
Rethinking MCU Architectures for the AI Era

Rethinking MCU Architectures for the AI Era

MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.


SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore Balances Power and Cooling Costs With Cryogenic Memory

SureCore has announced a low-power, cryogenic SRAM to reduce the energy demands of AI workloads on data centers.


News Jun 11, 2024 by Arjun Nijhawan
Applying IP Customization to Improve AI Chips: A Case Study

Applying IP Customization to Improve AI Chips: A Case Study

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP blocks, including standard cells and libraries? This article will help you answer this question.


Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.


News Jan 09, 2024 by Duane Benson