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Intel Beats the Data Center Heat With Open IP Immersion Liquid Cooling

Intel is aiming at a more sustainable data center with new investments and the industry’s first immersion cooling reference design.

About 14 hours ago by Jake Hertz

AMD SOM Kit Propels Robotics Beyond Custom Designs

Keen to free industrial robotics from the burdens of custom design, AMD has launched a SOM-based starter kit that puts ROS 2 and predefined interface apps into play.

May 17, 2022 by Jeff Child

MICROCHIP EMC1702 Current-Sense & Temperature Monitor | New Product Brief

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

November 22, 2021 by Mouser Electronics

The Importance of Fans for Indoor Air Filtration Systems

How much do you know about IAQ (indoor air quality) and filtration system options for purifying air?

August 04, 2021 by Sager Electronics

Nix the Heat Sink: New GaN ICs Aim to Slim Down Power Supply Design

Yesterday, Power Integrations released a new family of flyback controller ICs which leverage GaN technology for maximize efficiency. Could this help push GaN further mainstream?

May 25, 2021 by Jake Hertz

Learning From the Past: EV High Power Density Trends

With EVs being a hot topic recently, what trending designs were used in the past could be learned from? Oak Ridge National Laboratory aims to do just that through its benchmarking project.

May 20, 2021 by Dr. Steve Arar

Microsoft Brings the Sea to Servers With Two-phase Immersion Cooling

Microsoft has announced that it will be the first cloud provider to implement two-phase liquid immersion cooling in a production environment.

April 12, 2021 by Jake Hertz

Companies Get Creative to Beat the Heat in Computing Applications

Here's a sweep of a few thermal management techniques across the industry—specifically aimed to keep computing applications cool.

April 03, 2021 by Nicholas St. John

Deconstructing Xiaomi’s Mi 11 Ultra—and the Consumer Tech Claims Surrounding It

Xiaomi claims the Mi 11 Ultra is the "world’s best photography smartphone." With few technical specs published, how do designers approach such claims?

April 02, 2021 by Jake Hertz

As EVs Heat Up, Can Thermal Management Systems Cool Them Down?

Managing heat in EVs is no simple task. With materials research and heat-resistant power electronics, however, thermal management systems are slowly advancing EV adoption.

March 24, 2021 by Nicholas St. John

Keeping Wearables Cool: Non-metallic Material Radiates Heat From Users, Circuitry, and the Sun

Thermal design is especially delicate in wearable devices. Here are a few ways researchers are tackling the issue—the most recent turning to materials science.

March 20, 2021 by Jake Hertz

ROHM Module Casts Confidence on Wi-SUN FAN, the New Long-range Protocol on the Block

Wi-SUN FAN may be a worthwhile alternative to LoRaWAN and NB-IoT. Now, ROHM has developed a Wi-SUN FAN module with the promise of increased reliability and security in LPWA mesh networks.

March 02, 2021 by Jake Hertz

Data Centers are Only Getting Hotter, But Circuit Cooling Techniques Can Help

Data centers are increasingly overburdened, which drives up the heat. What are some common methods to cool them down?

January 04, 2021 by Antonio Anzaldua Jr.

Designing with a Heat Sink for Junction-to-Case Thermal Resistance

Watch the thermal measurement, junction-to-case thermal resistance, in action as we use it to calculate the thermal considerations for a given system.

December 31, 2020 by Dr. Steve Arar

Junction-to-Case Thermal Resistance in Thermal Design

Learn about an important thermal metric for designing the interface between an IC package and a heat sink.

December 30, 2020 by Dr. Steve Arar

Thermoelectric Coolers: A Low-Power, Eco-Friendly Design Option for Temperature Control

Thermoelectric coolers (TECs) are increasingly replacing traditional refrigeration technology. But despite all the virtues of TECs, these devices are not without limitations.

November 12, 2020 by Antonio Anzaldua Jr.

Why Thermal Management is a Hot Topic in 5G Design

As 5G barrels forward, engineers are increasingly talking about one of the major design challenges of this technology: thermal management.

October 21, 2020 by Dr. Steve Arar

Researchers Combine Transistor and Cooling System on a Single Chip

Semiconductor chips with integrated microfluidic cooling systems could lead to efficiencies that are currently impossible to achieve outside the lab.

September 24, 2020 by Luke James

Microsoft Sends a Data Center to the Ocean Floor to Find a COVID-19 Vaccine

Why underwater? The reason is actually quite practical: cooling.

June 18, 2020 by Gary Elinoff

U.S. Army Dedicates Research Study to Advancing Cooling Systems for Thermal Management Needs

Thermal management of electronics is critical for high-reliability applications and is essential to improve the performance of electrical systems such as those in EVs, smartphones, and laptops.

May 24, 2020 by Rushi Patel