After working at Apple on iPhones and at Microsoft on the Xbox 360 and Kinect, Agustya Mehta now helps develop leading-edge virtual reality products at Meta where they address the challenges of optimizing for performance, weight, and power.
January 16, 2024 by Daniel Bogdanoff
Calibrating your image signal processor is a complex engineering task, but it's critical for digital image quality. Learn about these nuances and about the resources available to help you tackle these challenges.
September 28, 2023 by John Phillippe, NXP Semiconductors
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
September 25, 2023 by Duane Benson
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys