Calibrating your image signal processor is a complex engineering task, but it's critical for digital image quality. Learn about these nuances and about the resources available to help you tackle these challenges.
21 hours ago by John Phillippe, NXP Semiconductors
Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.
3 days ago by Duane Benson
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys