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Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering a full-flow agentic environment that boosts engineering productivity by 15X.


News Jul 15, 2026 by Jeff Child
An Ultra-Low-Noise Pre-Amp For Audio Applications

An Ultra-Low-Noise Pre-Amp For Audio Applications

Build an ultra-low-noise preamplifier with a JFE150 JFET and OPA202 op-amp, perfect for high-impedance sensors, hydrophones, guitar pickups, microphones, and turntables.


Analyzing the Noise Performance of Coherent SSB Demodulators

Analyzing the Noise Performance of Coherent SSB Demodulators

Using a graphical approach, we show that coherent SSB demodulation leaves the input and output SNR unchanged, then compare its noise performance to DSB-SC and baseband systems.


A Four-Channel RS-422 Differential Line Receiver Module

A Four-Channel RS-422 Differential Line Receiver Module

This project brief describes how to build and use a four-channel differential line receiver module for balanced RS-422 and RS-485 data links.


Understanding SNR in DSB‑SC Coherent Detection: A Graphical Approach

Understanding SNR in DSB‑SC Coherent Detection: A Graphical Approach

Visualizing how correlated and uncorrelated signals combine offers an intuitive look at power transformation. See how this difference boosts baseband power to double the output SNR.


A Four-Channel RS-422 Differential Line Driver Module

A Four-Channel RS-422 Differential Line Driver Module

This project brief describes how to implement a four-channel differential line driver module for reliable long-distance data transmission over balanced twisted-pair lines.


Designing a Tuneable Ultrasonic Filter

Designing a Tuneable Ultrasonic Filter

Learn how to build a constant-bandwidth band-pass filter covering 20 kHz to 60 kHz, with an integrated frequency counter for precise tuning.


A 7 to 60 V Input Buck Converter: A Wide-Range DC-DC Step-Down Module

A 7 to 60 V Input Buck Converter: A Wide-Range DC-DC Step-Down Module

This project brief describes how to build a wide-range DC-DC buck converter capable of delivering a regulated 5.0 or 3.3 V output from input voltages ranging from 7 to 60 V.


Solving the Hard Problems: Combining AI and Physics for PCB Design

Solving the Hard Problems: Combining AI and Physics for PCB Design

Sergiy Nesterenko, founder and CEO of Quilter, discusses his journey from SpaceX to creating an AI platform that uses reinforcement learning and computational physics to fully automate complex PCB layouts.


Evaluating the Noise Performance of Coherent DSB‑SC Demodulators

Evaluating the Noise Performance of Coherent DSB‑SC Demodulators

In this article, we'll learn how to calculate the noise power and signal-to-noise ratio (SNR) of a double-sideband suppressed-carrier communication system.


The Isolated Half-Bridge: An IGBT Gate Driver Module with Current Sense

The Isolated Half-Bridge: An IGBT Gate Driver Module with Current Sense

This project brief describes how to assemble an isolated half-bridge IGBT gate driver module built around the NCD57085DR2G. It features onboard current sensing and overcurrent protection.


Accurate High-Voltage Measurement with the Vishay ISO-AC-VSAO Reference Design | Tech Guide

Accurate High-Voltage Measurement with the Vishay ISO-AC-VSAO Reference Design | Tech Guide

In this Tech Guide, learn how the Vishay ISO-AC-VSAO Reference Design enables accurate, isolated high-voltage AC measurement. Watch now to get started!


At Embedded World, Renesas 365 Advances to General Availability Phase

At Embedded World, Renesas 365 Advances to General Availability Phase

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.


News Mar 20, 2026 by Duane Benson
Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test engineers.


News Mar 05, 2026 by Luke James
Siemens Unveils AI-Enhanced PCB Design Tools for Mid-Range Users

Siemens Unveils AI-Enhanced PCB Design Tools for Mid-Range Users

New software editions bring enterprise-grade functionality to small- and medium-sized teams.


News Jun 02, 2025 by Jake Hertz
2024’s Top Technical Articles and More

2024’s Top Technical Articles and More

As 2024 comes to an end, we look back on the year's most popular technical articles, industry articles, and projects.


News Dec 30, 2024 by Abby Garfinkle
Using Programmable Logic Devices for Systematic Power-Up Sequencing

Using Programmable Logic Devices for Systematic Power-Up Sequencing

Learn how single-chip programmable logic devices (PLDs) can replace multiple discrete components used in power-up sequencing circuits to save cost and PCB area.


Transferring SPICE Models From LTspice to QSPICE

Transferring SPICE Models From LTspice to QSPICE

In this article, we'll walk through the process of importing SPICE models into QSPICE and demonstrate the basics of using the QSPICE waveform viewer, including measurement markers.


Transferring LTspice Schematics to QSPICE

Transferring LTspice Schematics to QSPICE

In this article, we'll walk through the process of moving an LTspice circuit into QSPICE and learn some QSPICE schematic techniques.