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Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.


News Jul 27, 2026 by Luke James
4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

New HBM, UFS, NAND, and EEPROM devices span the storage stack.


News Jul 24, 2026 by Jake Hertz
Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


AI Pipeline Storage Demands Optimal Performance, Efficiency

AI Pipeline Storage Demands Optimal Performance, Efficiency

Artificial intelligence data pipelines are placing new pressures on enterprise storage, and data centers must rapidly adapt storage capabilities with SSDs as their backbone.


OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
Kingston 2.5” SATAIII Enterprise Solid State Drives | New Product Brief

Kingston 2.5” SATAIII Enterprise Solid State Drives | New Product Brief

Kingston 2.5" SATAIII Enterprise SSDs provide reliable, high-performance storage designed to meet the demands of modern data centers and enterprise environments. Watch and learn all about their features, specs, applications, and more!


AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child
Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets

The Korean unicorn packages four NPU dies with 144 GB of HBM3E and bets on an open software stack to serve large language models at lower cost per token.


News Jun 29, 2026 by Jake Hertz
Geehy Semiconductor Unwraps Family of Automotive Arm Cortex M0+ MCUs

Geehy Semiconductor Unwraps Family of Automotive Arm Cortex M0+ MCUs

Three new Arm Cortex M0+ MCUs added to the G32A family target “central computing and regional control” automotive accessory applications.


News Jun 16, 2026 by Duane Benson
Rambus Rolls Out Memory Chipset to Unburden AI PCs

Rambus Rolls Out Memory Chipset to Unburden AI PCs

The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.


News Jun 15, 2026 by Jake Hertz
France’s Drive to Rebuild a Native Semiconductor Industry

France’s Drive to Rebuild a Native Semiconductor Industry

France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market challenges it’s facing.


News Jun 11, 2026 by Gordon Feller
Spinning Disks Sputter as AI Heats up Data

Spinning Disks Sputter as AI Heats up Data

AI-driven data demands are outpacing traditional HDDs. System developers must migrate to high-performance, secure, and efficient NVMe SSDs to scale for AI workloads.


Bricking Proof: Designing Safety-Critical RTL for eFuse Controllers

Bricking Proof: Designing Safety-Critical RTL for eFuse Controllers

An RTL glitch in an eFuse controller can permanently brick costly silicon. This article covers defense-in-depth FSM design, redundant watchdogs, and formal SVA verification.


Edge AI Development Is a Lifecycle Problem

Edge AI Development Is a Lifecycle Problem

Edge AI success is limited by memory and power. Fragmented tools cause failures. Learn how a cohesive, full-lifecycle approach unifying design and deployment is essential for scalable systems.


Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

The Hidden Cooling Bottleneck Inside Liquid-Cooled AI Data Centers

Learn how liquid cooling eliminates system airflow, creating a hidden thermal bottleneck for 'left-behind' components like memory and SSDs. Targeted micro-cooling is required to restore system balance.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller