Based on the Arm Cortex-M23 32-bit core, the RA2E2 microcontroller unit (MCU) group hopes to bring more scalability to the internet of things (IoT) endpoint applications.
one day ago by Abdulwaliy Oyekunle
Data centers are facing serious challenges as technology continues to boom and Micron is out to keep them at bay with its latest solid-state drive.
October 07, 2021 by Jake Hertz
In an AAC interview with MIT's faculty Jennifer Rupp and Ericsson's Dr. Saeed Bastani, we learned how a new field, "lithionics," could be the key to advancing neuromorphic computing.
October 04, 2021 by Adrian Gibbons
AI applications bring with them many challenges, including data processing and memory. Samsung hopes to take on these issues by combining processing-in-memory with high bandwidth memory.
August 30, 2021 by Antonio Anzaldua Jr.
Traditional NAND often faces power, performance, and cost inefficiencies. NEO Semiconductor has announced recently-patented X-NAND to bypass these limitations.
August 18, 2021 by Ikimi .O
Often overlooked, reference designs can be an EEs best friend. Maxim Integrated, STMicroelectronics, and Microchip aim to help design facial detecting IoT, MasterGaN devices, and for Qi 1.3.
July 31, 2021 by Antonio Anzaldua Jr.
As the need for hardware security increases, companies are searching for ways to use PUF. CrossBar claims its newest resistive-RAM technology could be suited for a new class of PUF applications.
July 22, 2021 by Jake Hertz
Since the industry is zeroing in on high-performance computing, NVIDIA throws its hat into the HPC ring with its release of a new platform: the HGX HPC platform.
July 19, 2021 by Ikimi .O
Fast on the heels of the AI Edge series, Xilinx releases the Versal HBM Advanced Compute Acceleration Platform (ACAP), claiming 800% more memory bandwidth at 63% lower power over DDR5.
July 14, 2021 by Adrian Gibbons
Recently, AAC had the chance to talk to Xilinx about its newest family member in the Versal series of adaptive compute acceleration platforms, the Versal AI Edge series.
June 09, 2021 by Adrian Gibbons
A seemingly unique and fruitful approach, analog processing has been the key to Mythic AI’s success. Its newest processor could be a hopeful contender in the world of edge computing.
June 07, 2021 by Jake Hertz
Recent research spurs the prospect of 2D layered materials having the potential to play a significant role in memory and data processing applications.
May 14, 2021 by Antonio Anzaldua Jr.
Die stacking is becoming more commonplace with Samsung Electronics' next-generation 2.5D advanced package technology.
May 10, 2021 by Adrian Gibbons
You've heard of software-defined radio, but how about software-defined storage? The latest from IBM gives us a chance to catch up on this cloud-focused technology.
May 03, 2021 by Antonio Anzaldua Jr.
Chasing low power consumption is the holy grail of IoT design considerations. With that in mind, Dialog introduces their new AT25EU NOR Flash to answer the call.
April 30, 2021 by Adrian Gibbons
With its newest iteration of BlueField DPU technology, NVIDIA is reworking a new processing unit to support mountainous AI workloads.
April 16, 2021 by Tyler Charboneau
While fabrication grounds to a halt and the electronics supply chain shutters, chip manufacturers and researchers are still hard at work developing better memory technology for enhanced compute potential.
April 08, 2021 by Adrian Gibbons
Leakage current is yet another hurdle as Moore's law marches on. Manufacturing techniques, design methods, and research projects are taking on the challenge.
April 05, 2021 by Jake Hertz
With mounting data demands, Samsung has unveiled a new DDR5 module with HKMG process technology to accommodate AI, ML, and supercomputing applications.
April 02, 2021 by Antonio Anzaldua Jr.
Micron has announced the sale of its Utah chip factory as it ceases production of a once "revolutionary" memory chip developed in partnership with Intel.
March 23, 2021 by Luke James
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