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Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

Summit 2026 Keynote - The Quiet Giant Goes All In: MediaTek is Diving Into AI Datacenters

After building a $10B+ smartphone business, Yenchi Lee is standing up MediaTek's Datacenter BU from scratch to tackle full-stack AI silicon, 2.5D packaging, and co-packaged optics.


News Oct 07, 2026 by Dale Wilson
Automated 3D Reconstruction: How Chipmakers Can Keep Pace in the AI Era

Automated 3D Reconstruction: How Chipmakers Can Keep Pace in the AI Era

As chipmakers stack dies vertically to meet surging AI demand, 2D imaging is losing its edge. Automated 3D reconstruction is becoming essential to keeping fabs on pace.


AtlasBase Debuts Bio-Silicon Chip for Breaking Data Center Storage Bottlenecks

AtlasBase Debuts Bio-Silicon Chip for Breaking Data Center Storage Bottlenecks

Announced today by AtlasBase, Thalia is a 5.6B-well bio-silicon chip that uses synthetic DNA to break power and density bottlenecks in AI data center storage and molecular computing.


News Sep 22, 2026 by Jeff Child
Delos Data Unveils Architecture and Silicon to Break AI Interconnect Bottlenecks

Delos Data Unveils Architecture and Silicon to Break AI Interconnect Bottlenecks

Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.


News Sep 15, 2026 by Jeff Child
AI Craze Drives Wave of Semiconductor Deals Toward $1T Chip Era

AI Craze Drives Wave of Semiconductor Deals Toward $1T Chip Era

In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall Street financing to washing machines.


News Aug 26, 2026 by Luke James
NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

NXP Launches MCUs Blending 10BASE-T1S Ethernet and Post-Quantum Security

The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.


News Aug 25, 2026 by Jeff Child
Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

Microchip Debuts Rev 2 of Its PolarFire FPGA Ethernet Sensor Bridge

The new PolarFire FPGA-powered board from Microchip brings multiple sensors to Nvidia edge AI platforms.


News Aug 24, 2026 by Duane Benson
Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity

Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity

The controller, PHY, security, and verification IP support 128 GT/s links and target rack-scale memory pools exceeding 100 TB.


News Aug 21, 2026 by Luke James
Rethinking Storage Architecture for Software-Defined Embedded Systems

Rethinking Storage Architecture for Software-Defined Embedded Systems

As software-defined embedded systems evolve, dynamic storage architectures replace static partitioning to optimize flash efficiency, support long-term updates, and control rising hardware costs.


Memorable Memory: 5 Highlights From the Future of Memory & Storage Show

Memorable Memory: 5 Highlights From the Future of Memory & Storage Show

Industry leaders used FMS 2026 to introduce a suite of new memory advancements, from denser QLC NAND to 16,000 MT/s DDR5.


News Aug 11, 2026 by Jake Hertz
Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

Rambus Serves Up DDR5 RDIMM Server Chipset for Next-Gen AI Data Centers

The new registering clock driver raises registered DIMM data rates to 9,600 MT/s for CPU-based servers.


News Aug 04, 2026 by Jake Hertz
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

Samsung Releases PCIe 6.0 SSD Tailored for Next-Gen AI Infrastructure

The PM1763 pairs a newly developed 4-nm controller with ninth-generation V-NAND, more than doubling the throughput of Samsung's fastest PCIe 5.0 enterprise drive.


News Jul 27, 2026 by Luke James
4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

4 New Memory ICs Scale From AI Accelerators to Industrial Sensors

New HBM, UFS, NAND, and EEPROM devices span the storage stack.


News Jul 24, 2026 by Jake Hertz
Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


AI Pipeline Storage Demands Optimal Performance, Efficiency

AI Pipeline Storage Demands Optimal Performance, Efficiency

Artificial intelligence data pipelines are placing new pressures on enterprise storage, and data centers must rapidly adapt storage capabilities with SSDs as their backbone.


OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

OECD Is Putting Supply Chain, Value Chain, and Subsidies in the Spotlight

The OECD is analyzing the semiconductor industry, focusing on supply chain resilience, global value chain mapping, and the impact of rising industrial subsidies on global market competition.


News Jul 09, 2026 by Gordon Feller
Kingston 2.5” SATAIII Enterprise Solid State Drives | New Product Brief

Kingston 2.5” SATAIII Enterprise Solid State Drives | New Product Brief

Kingston 2.5" SATAIII Enterprise SSDs provide reliable, high-performance storage designed to meet the demands of modern data centers and enterprise environments. Watch and learn all about their features, specs, applications, and more!


new products Jul 06, 2026 by Mouser
AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

AMD Unveils Adaptive SoC With 32 GB of Memory-on-Package Embedded DRAM

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.


News Jun 30, 2026 by Jeff Child
Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Exclusive—Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure.


News Jun 30, 2026 by Jeff Child