New research has unveiled that it’s possible to switch states of magnetism between ON and OFF in a new class of easy-to-fabricate materials containing nitrogen.
2 days ago by Luke James
In what the company has described as a breakthrough in flash memory, performance, and density, Micron has shipped the world’s first 176-layer 3D NAND.
November 17, 2020 by Luke James
With the demand for in-memory computation increasing, Xilinx and Samsung have set out to create a “one size fits all” solution.
November 13, 2020 by Jake Hertz
Analysts predict that DDR5 will dominate the DRAM market in coming years. How do you calibrate DDR for peak memory performance?
November 06, 2020 by Steve Arar
Designing memory architectures for AI/ML devices may feel like an impassable compromise with storage volume, speed, and processing. A new in-memory computing accelerator may be a useful solution.
November 03, 2020 by Jake Hertz
As an EE, you might wonder how DDR5 can support blazing-fast transfer rates. One factor is an equalization technique called decision feedback equalization (DFE).
October 29, 2020 by Steve Arar
As 5G speed and storage demands collide with the end of Moore's law, chipmakers are turning to multichip packaging to save space and power.
October 26, 2020 by Steve Arar
US chipmaker Intel is selling part of its NAND memory chip business to SK Hynix for $9 billion in a deal that will see the South Korean semiconductor supplier become the world’s second-largest flash memory chipmaker.
October 22, 2020 by Luke James
This week, Arm announced that it will transfer its entire CeRAM IP portfolio to a new spin-out from the company, Cerfe Labs, while taking minority ownership stake in the new company.
October 08, 2020 by Jake Hertz
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
October 03, 2020 by Mouser Electronics
Engineers in South Korea have developed a process that could lead to the realization of embedded wearable electronics.
October 03, 2020 by Luke James
NVMe controller technology can be difficult and expensive for academics to get their hands on. Now, a new open-source option may help EE students prototype new storage devices.
September 22, 2020 by Luke James
With no definitive release date for DDR5, DDR4 is making significant strides.
September 18, 2020 by Antonio Anzaldua Jr.
This week, Renesas has released their newest product: a data buffer for DDR5 aimed at empowering a new generation of high-performance computing applications.
September 11, 2020 by Jake Hertz
The new Arm Cortex-R82 looks to address the imminent challenges of mass data creation and processing needs.
September 09, 2020 by Jake Hertz
Winbond High-Performance Serial NAND (QspiNAND) offers reliable, lower-cost alternative to SPI NOR Flash in 1Gbit and 2Gbit capacities for automotive displays and instrument clusters.
In partnership with Winbond
The connected cars of the future will require three primary displays: instrument clusters, center stacks, and heads-up displays. Learn how Winbond's Flash memory solutions serve displays for ADAS-enabled vehicles.
Faster flash erase and program capabilities can improve not only manufacturing throughput, thus lowering costs, but also provide better performance.
In the age of COVID-19, medical wearable security and data storage stand to change immensely.
One of the most essential, and vulnerable, elements of IoT devices involves firmware updates. Winbond's W77Q addresses key security concerns.
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