Amphenol FCI DDR5/LPDDR5 CAMM2 Connectors deliver a high-density, low-profile compression-contact memory interface for next-generation computing platforms. Watch…
Amphenol FCI DDR5/LPDDR5 CAMM2 Connectors deliver a high-density, low-profile compression-contact memory interface for next-generation computing platforms. Watch and learn all about their features, specs, applications, and more!
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a…
Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.
Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity…
Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity and a low-voltage NOR flash that cuts power use by a third.
Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories,…
Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.
SK Hynix's new LPDDR6 SDRAM exhibits five key innovations to improve performance, reduce power consumption, and increase…
SK Hynix's new LPDDR6 SDRAM exhibits five key innovations to improve performance, reduce power consumption, and increase reliability.
In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts…
In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a…
The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.
The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.
The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.
Intel’s 2716 and 2732 took UV EPROMs from “power-supply problem” to practical, socketable firmware for mainstream…
Intel’s 2716 and 2732 took UV EPROMs from “power-supply problem” to practical, socketable firmware for mainstream 8-bit and early 16-bit designs.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Mostek’s 16K MK4116 and its 64K successor, the MK4164, became the DRAMs that defined late-1970s and early-1980s…
Mostek’s 16K MK4116 and its 64K successor, the MK4164, became the DRAMs that defined late-1970s and early-1980s microcomputers and set conventions the industry followed for years.
Look out, flash! With a resounding vote of confidence from Texas Instruments and Onsemi, ReRAM may be here to stay.
Look out, flash! With a resounding vote of confidence from Texas Instruments and Onsemi, ReRAM may be here to stay.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
In this article, Gordon posed a set of questions to TSMC about their next steps going forward.
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
Enjoy this roundup of our favorite All About Circuits research news articles of 2025!
Learn how this new type of AI processor provides a 100x improvement in power and performance over conventional GPUs or MCUs.
Learn how this new type of AI processor provides a 100x improvement in power and performance over conventional GPUs or MCUs.
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in…
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.
The company optimized the device's dual-voltage design for high-speed, low-power 1.2 V SoC applications.
The company optimized the device's dual-voltage design for high-speed, low-power 1.2 V SoC applications.
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech,…
Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech, such as HBM, amid global competition, US controls, and government support.
The new device is the first sixth-generation registered clock driver for DDR5 registered dual in-line memory modules.
The new device is the first sixth-generation registered clock driver for DDR5 registered dual in-line memory modules.
Toshiba adds a new tier to its surveillance lineup with a hard disk drive built to handle AI-driven video systems at scale.
Toshiba adds a new tier to its surveillance lineup with a hard disk drive built to handle AI-driven video systems at scale.
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