Learn five alternatives to spread spectrum for EMI mitigation in switched-mode power supplies: passive and active EMI filtering, slew rate control, advanced packaging, and PCB layout optimization.
November 30, 2023 by Jonathan Riley, Texas Instruments
Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets, costs, and power consumption. Get up to speed on MIMO, MU-MIMO, MU-OFDMA, and more.
November 16, 2023 by Franz Dugand, CEVA
Selecting the right power MOSFET for your DC-DC converter can improve efficiency and minimize heating. Learn the tradeoffs associated with MOSFET on-resistance and gate charge for an H-bridge buck-boost DC-DC converter design.
October 12, 2023 by Hiroshi Takei, Toshiba
Calibrating your image signal processor is a complex engineering task, but it's critical for digital image quality. Learn about these nuances and about the resources available to help you tackle these challenges.
September 28, 2023 by John Phillippe, NXP Semiconductors
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
Detailed simulations of the thermal behavior of MOSFETs in a closed chassis allow the development of guidelines for improving system design for MOSFET placement in conjunction with the use of fans, grills, and heatsinks.
August 24, 2023 by Toshiaki Hosoya, Toshiba
The latest advances in radiation-hardened digital components have enabled the development of MCXOs that, for the first time, can replace larger, high-power-consuming OCXOs in low-earth orbit (LEO) New Space applications.
May 18, 2023 by Ronald Stephens, Q-Tech Corporation
The way your PCB’s layers are arranged has huge implications for the board’s efficiency. Learn the basics of PCB stackups, and how Fusion 360’s stackup tool helps manage your PCB’s layering strategy.
March 09, 2023 by Edwin Robledo, Fusion 360 Electronics