The latest advances in radiation-hardened digital components have enabled the development of MCXOs that, for the first time, can replace larger, high-power-consuming OCXOs in low-earth orbit (LEO) New Space applications.
May 18, 2023 by Ronald Stephens, Q-Tech Corporation
The way your PCB’s layers are arranged has huge implications for the board’s efficiency. Learn the basics of PCB stackups, and how Fusion 360’s stackup tool helps manage your PCB’s layering strategy.
March 09, 2023 by Edwin Robledo, Fusion 360 Electronics
There are a host of tricky challenges that emerge when debugging complicated I2C and SPI errors. Learn how leveraging key features of today’s advanced oscilloscopes can smooth the way.
March 02, 2023 by Daniel Monforte, RIGOL Technologies
When developing lighting and indicator devices, surface mounted diode (SMD) LEDs offer a variety of benefits. Learn the options available—including multi-color SMD LEDs—and the advantages they provide.
February 16, 2023 by Mario Davila and Alan Sanchez, VCC
While their issues and challenges are distinct, both automotive and industrial systems rely on DC-DC switching regulator technology. Learn how to navigate these issues and make smart engineering choices.
February 02, 2023 by Mitch Van Ochten, ROHM Semiconductor
Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the process and how advanced CAM processing tools enable a smooth transition to the production phase.
January 26, 2023 by Edwin Robledo, Fusion 360 Electronics
Designing smart home devices involves numerous challenges. In this article, learn the important limitations of today’s smart home technologies and how sensor fusion helps smooth the way.
January 19, 2023 by Paul Lee, Infineon Technologies
There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.
December 08, 2022 by Toshiaki Hosoya, Toshiba
Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.
November 03, 2022 by Edwin Robledo, Fusion 360 Electronics
Learn some of the high-level basics of magnetic integrated connector modules (ICMs), some of the tasks they are used to accomplish, and look at an example product from Bel Fuse.
October 06, 2022 by Jeff Kring, Bel Magnetic Solutions & TRP Connector