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PCB Stackup Basics and Using Fusion 360’s Stackup Manager

The way your PCB’s layers are arranged has huge implications for the board’s efficiency. Learn the basics of PCB stackups, and how Fusion 360’s stackup tool helps manage your PCB’s layering strategy.

March 09, 2023 by Edwin Robledo, Fusion 360 Electronics

Debugging Common I2C and SPI Problems with Advanced Oscilloscopes

There are a host of tricky challenges that emerge when debugging complicated I2C and SPI errors. Learn how leveraging key features of today’s advanced oscilloscopes can smooth the way.

March 02, 2023 by Daniel Monforte, RIGOL Technologies

SMD LED Considerations for Lighting and Indicator Applications

When developing lighting and indicator devices, surface mounted diode (SMD) LEDs offer a variety of benefits. Learn the options available—including multi-color SMD LEDs—and the advantages they provide.

February 16, 2023 by Mario Davila and Alan Sanchez, VCC

Improve Signal Integrity by Reducing PCB Trace Impedance Variation

Achieving better signal integrity in a PCB design can be a challenge. Learn how PCB trace impedance variation plays a role, and how advanced tools can help smooth the way.

February 09, 2023 by Edwin Robledo, Fusion 360 Electronics

DC-DC Switching Regulators Zero In on Automotive and Industrial Designs

While their issues and challenges are distinct, both automotive and industrial systems rely on DC-DC switching regulator technology. Learn how to navigate these issues and make smart engineering choices.

February 02, 2023 by Mitch Van Ochten, ROHM Semiconductor

Learn the Fundamentals of CAM: Manufacturing Your PCB

Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the process and how advanced CAM processing tools enable a smooth transition to the production phase.

January 26, 2023 by Edwin Robledo, Fusion 360 Electronics

Getting the Most Out of USB-C/PD System Designs

USB-C/PD brings significant improvements to the USB connectivity world. In this article, learn how this technology simplifies system designs and the solutions available to implement USB-C/PD.

January 24, 2023 by George Hariman, ROHM Semiconductor

Overcome Smart Home Technology Limits Using Sensors and Edge Computing

Designing smart home devices involves numerous challenges. In this article, learn the important limitations of today’s smart home technologies and how sensor fusion helps smooth the way.

January 19, 2023 by Paul Lee, Infineon Technologies

Understanding Methods to Automate Data Quality Management

Automated data testing is critical, especially in this era of huge datasets. Learn the different methods for testing data quality and how SaaS tools and machine learning can smooth the way.

January 12, 2023 by Rich Taylor, Anomalo

Building Seamless and Secure Industrial Networks Using TSN

Moving toward Industry 4.0 is about implementing highly automated and interconnected factories and infrastructure. Learn how time-sensitive networking (TSN) technologies can make this a reality.

January 05, 2023 by Christian Castel, NXP

Half-bridge DC-DC Converter Scheme Shrinks Power in Data Centers

To keep power under control, data centers are embracing new rack architectures based on 48 V bus voltages. Learn how to craft a half-bridge DC-DC converter to implement such a 48 V system.

December 29, 2022 by Hiroshi Takei, Toshiba

USB PD vs. USB-C: Differences, Benefits, and Adapters

Learn the key aspects that separate USB PD and USB-C and understand the design issues and solutions that you need to consider when embarking on a USB PD design.

December 20, 2022 by Bruce Rose, CUI

Interference Hunting in 5G Networks

Interference hunting is a complex task at the 5G level—mmWave signals behave differently than those at sub-6 GHz. It's less about noise and more about blockage.

December 15, 2022 by Peter Busch, Rohde & Schwarz

Thermal Management for Designs Using Discrete Semiconductor Devices

There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.

December 08, 2022 by Toshiaki Hosoya, Toshiba

Using 3D Electronic Component Models to Synch PCB and Enclosure Designs

Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.

November 03, 2022 by Edwin Robledo, Fusion 360 Electronics

Mixed-safety Systems Using Multicore SoCs With Hypervisors and Multicore Frameworks

Learn about how heterogeneous multicore systems-on-chip (SoCs), hypervisors, and multicore frameworks can be useful in mixed-safety systems.

October 26, 2022 by Jeff Hancock, Siemens Software

Design and Selection of Magnetic ICM Modules to Ease Ethernet EMI/EMC Challenges

Learn some of the high-level basics of magnetic integrated connector modules (ICMs), some of the tasks they are used to accomplish, and look at an example product from Bel Fuse.

October 06, 2022 by Jeff Kring, Bel Magnetic Solutions & TRP Connector

Considerations for Choosing Edge ML Application Hardware

As edge machine learning (ML) applications keep growing, EEs need to understand ML at the edge, especially concerning processing and processing hardware.

September 01, 2022 by Ali Osman Ors, NXP Semiconductors

Understanding Illumination: LED Lighting Solutions For Battery-powered Electronics

Learn about the need for advanced illumination before examining trends in LED performance and customizable light-emitting diode (LED) colors.

August 12, 2022 by George Lacanilao, ROHM Semiconductor

Dependability in Zonal E/E Architectures with Central Compute for Autonomous Driving

This article explores how dependable electronics like sensors and MCUs within zonal E/E architectures are important for reliable, safe, and secure autonomous vehicles (AVs).

August 04, 2022 by Infineon Technologies