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Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


Designing Ultra-Low-Power Smart Thermostats with Latching Solid-State Relays

Designing Ultra-Low-Power Smart Thermostats with Latching Solid-State Relays

A load-powered relay architecture allows smart HVAC controllers to operate without batteries or a common wire while enabling compact, silent switching.


Proving Reliability in Critical Embedded Systems

Proving Reliability in Critical Embedded Systems

Learn how formal verification uses math to prove the absence of runtime errors in complex embedded software for critical defense/space systems, offering stronger reliability than testing.


Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Nanoscale SCE: Electrostatic Challenges and FinFET/GAA Mitigation Solutions

Learn how scaling beyond Dennard's limits triggered short-channel effects (SCE) and why transitioning from FinFET to Gate-All-Around (GAA) architectures is vital for 2 nm control.


Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.


Modular Architecture: The Key to Reliable EV Charging Infrastructure

Modular Architecture: The Key to Reliable EV Charging Infrastructure

Learn how modular design principles contribute to EV charger reliability, scalability, and maintenance for engineers planning charging networks.


Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology. This meets the design needs of next-gen, MW-scale AI server infrastructure.


Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Learn how evolving regulations, lifecycle security strategies, and quantum-ready cryptography are reshaping automotive cybersecurity.


Software-Defined Systems: Reshaping the Future of Modern Cars

Software-Defined Systems: Reshaping the Future of Modern Cars

This article explores how digital twins can help to reshape the design methodology of automotive semiconductors and systems, enabling truly software-defined vehicles.


The Countdown: Preparing Manufacturing Systems for the Post-Quantum Era

The Countdown: Preparing Manufacturing Systems for the Post-Quantum Era

Decades of captured data and IP face future exposure from harvest-now, decrypt-later attacks. Products and systems built today need quantum-resistant security integrated from design through deployment.


The New Moore’s Law: Why Optical Computing Could Redefine Scaling for AI

The New Moore’s Law: Why Optical Computing Could Redefine Scaling for AI

Optical computing is the "New Moore's Law" for AI. It solves electronic scaling limits, offering higher speed, lower power, and efficiency gains proportional to problem size for matrix operations.


The Configurable Matrix Computer: A New Alternative to the von Neumann Architecture

The Configurable Matrix Computer: A New Alternative to the von Neumann Architecture

Learn how this new type of AI processor provides a 100x improvement in power and performance over conventional GPUs or MCUs.


Building a DIY Probe Station

Building a DIY Probe Station

This how-to guide outlines everything you'll need to build a basic probe station on a budget.


FPGAs Need a New Future

FPGAs Need a New Future

FPGAs are limited by outdated proprietary software. Learn how embracing open-source tools is necessary to modernize FPGA development and unlock their full potential.


My Experience with the Zephyr RTOS—A Hands-On Review

My Experience with the Zephyr RTOS—A Hands-On Review

Robert recently tried the Zephyr RTOS and contributed back to the project in the form of a sensor driver for the MTCH9010 liquid leak detector. In this article, he shares his thoughts.


Edge AI’s Next Battlefield: Development Tools

Edge AI’s Next Battlefield: Development Tools

Learn why the best silicon is useless without the right AI developer tools.


Top-Down vs. Bottom-Up: Charting a Path to Sub-GHz Deployment

Top-Down vs. Bottom-Up: Charting a Path to Sub-GHz Deployment

Making informed choices about network ecosystems, protocols, and hardware is critical when developing large-scale IoT networks. Learn more in this article.


Solving the QLC NAND Flash SSD Scaling Challenge

Solving the QLC NAND Flash SSD Scaling Challenge

Learn how to solve QLC NAND's endurance, ECC, and performance issues for hyperscale. The approach blends a PCIe Gen5 controller with hardware-accelerated LDPC, PerformaShape QoS, and more.


A New Generation of RF Switches at the Heart of 5G Systems

A New Generation of RF Switches at the Heart of 5G Systems

Learn how advanced RF MEMS switches with high linearity, low loss, and fast switching speeds are enabling modern cellular communication systems.