Outfitting earbuds with more AI can be a challenge. Learn how compression techniques like sparsity, quantization, and memory-aware scheduling can help smooth the way.
Outfitting earbuds with more AI can be a challenge. Learn how compression techniques like sparsity, quantization, and memory-aware scheduling can help smooth the way.
MEMS-based miniature-fan technology can provide improved thermal performance, increased reliability, and reduced noise…
MEMS-based miniature-fan technology can provide improved thermal performance, increased reliability, and reduced noise for advanced processors.
AI will push the limits of PCs and smartphones. In turn, demands on storage controller chips will be intense. Learn how…
AI will push the limits of PCs and smartphones. In turn, demands on storage controller chips will be intense. Learn how chip architectures and firmware schemes must be optimized for these AI workloads.
MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn…
MCUs that only do control tasks are one thing. But in today’s AI age, a truly AI-enabled MCU needs to offer more. Learn the important factors—from optimized neural processing units (NPUs) to power efficient architectures to clever memory topologies.
As USB PD 3.1 devices proliferate, high-voltages increase the risk of electrostatic issues. To address these problems,…
As USB PD 3.1 devices proliferate, high-voltages increase the risk of electrostatic issues. To address these problems, learn how to make smart choices in ESD and EOS testing, as well as TVS device selection.
Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets,…
Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets, costs, and power consumption. Get up to speed on MIMO, MU-MIMO, MU-OFDMA, and more.
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both…
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
When developing lighting and indicator devices, surface mounted diode (SMD) LEDs offer a variety of benefits. Learn the…
When developing lighting and indicator devices, surface mounted diode (SMD) LEDs offer a variety of benefits. Learn the options available—including multi-color SMD LEDs—and the advantages they provide.
USB-C/PD brings significant improvements to the USB connectivity world. In this article, learn how this technology…
USB-C/PD brings significant improvements to the USB connectivity world. In this article, learn how this technology simplifies system designs and the solutions available to implement USB-C/PD.
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