The way your PCB’s layers are arranged has huge implications for the board’s efficiency. Learn the basics of PCB stackups, and how Fusion 360’s stackup tool helps manage your PCB’s layering strategy.
March 09, 2023 by Edwin Robledo, Fusion 360 Electronics
Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the process and how advanced CAM processing tools enable a smooth transition to the production phase.
January 26, 2023 by Edwin Robledo, Fusion 360 Electronics
There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working.
December 08, 2022 by Toshiaki Hosoya, Toshiba
Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.
November 03, 2022 by Edwin Robledo, Fusion 360 Electronics
One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
November 11, 2021 by Sarah Kuang, Kinwong
In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.
June 29, 2021 by Todd Phillips, Littelfuse
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
February 04, 2021 by Matt Hein, Texas Instruments
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.
January 12, 2021 by Tam Do, Microchip
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
November 03, 2020 by Brian Niehoff, Samtec
MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have come a long way and are continuing to evolve. In this article, learn the past and future of these design tools.
August 27, 2020 by Sam Sattel, Autodesk
Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.
August 25, 2020 by Tamara Lin, Intel
Intermediate Bus Architecture is an emerging method that power designers are using to conserve PCB space. This article discusses the solution benefits and tradeoffs of adopting this technique, and how it may be scaled to address application-specific requirements.
July 07, 2020 by Tamara Lin, Intel
In this article, Octopart's Director of Operations for Part Data Geof Lipman explores how traditional CAD modeling needs to change in order for electrical engineers to keep up with product design deadlines.
March 10, 2020 by Geof Lipman, Octopart
In part 12 of Resolving the Signal, we look at a power-supply noise design example to discuss which supplies are most critical when trying to increase a system's PSR. From that example, we offer best practices to maintain low power-supply noise and debugging tips for a system's overall noise performance.
January 29, 2019 by Bryan Lizon, Texas Instruments
