Latest Layout Industry Articles

Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion…

Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that…

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.

In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we…

In this second installment of the "Protect Your Ports! Top Design Tips to Keep Your Communications Connected" series, we explore what protecting high-speed interfaces looks like, including USB, HDMI, DisplayPort, and eSATA.

This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and…

This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This…

Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.  

Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about…

Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about how to leverage the different modeling methods in Fusion 360.

Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of…

Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of complex designs.

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as…

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.

This article dives into how Fusion 360 can be used to produce smarter microelectronics.

This article dives into how Fusion 360 can be used to produce smarter microelectronics.

MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have…

MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have come a long way and are continuing to evolve. In this article, learn the past and future of these design tools.

Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a…

Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.

Intermediate Bus Architecture is an emerging method that power designers are using to conserve PCB space. This article…

Intermediate Bus Architecture is an emerging method that power designers are using to conserve PCB space. This article discusses the solution benefits and tradeoffs of adopting this technique, and how it may be scaled to address application-specific requirements.

In this article, Octopart's Director of Operations for Part Data Geof Lipman explores how traditional CAD modeling needs…

In this article, Octopart's Director of Operations for Part Data Geof Lipman explores how traditional CAD modeling needs to change in order for electrical engineers to keep up with product design deadlines.

This article discusses the issues surrounding trace-width calculation and provides a solid foundation for designing your…

This article discusses the issues surrounding trace-width calculation and provides a solid foundation for designing your next high-current net.

This article introduces and explores advanced ERC, highlighting its differences from traditional ERC and discussing how…

This article introduces and explores advanced ERC, highlighting its differences from traditional ERC and discussing how it can help create better circuit designs.

In part 12 of Resolving the Signal, we look at a power-supply noise design example to discuss which supplies are most…

In part 12 of Resolving the Signal, we look at a power-supply noise design example to discuss which supplies are most critical when trying to increase a system's PSR. From that example, we offer best practices to maintain low power-supply noise and debugging tips for a system's overall noise performance.

In this article, Parker Dillman, lead EE and co-founder of MacroFab, covers how to best prepare your PCB designs for…

In this article, Parker Dillman, lead EE and co-founder of MacroFab, covers how to best prepare your PCB designs for fabrication and assembly.

Part 10 of the Resolving the Signal series covers how clocks affect precision ADCs, touching on clock jitter, clock…

Part 10 of the Resolving the Signal series covers how clocks affect precision ADCs, touching on clock jitter, clock intermodulation and best PCB layout practices for clocking.

This article will briefly discuss isolation in the process control analog input module and the traditional approaches to…

This article will briefly discuss isolation in the process control analog input module and the traditional approaches to achieving this. It then outlines an alternative high density, easy to design channel-to-channel isolation analog input module architecture.