One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
November 11, 2021 by Sarah Kuang, Kinwong
The next step of wide-area wireless connection is to bring the power of wireless to machine type communications (MTC). This will drive a revolution in services that will span sectors as diverse as manufacturing, city management, transportation, and energy.
October 17, 2017 by Emmanuel Gresset, CEVA
Passive intermodulation represents the intermodulation products generated when two or more signals transit through a passive device with nonlinear properties. The interaction of mechanical components generally causes nonlinear elements.
May 09, 2017 by Frank Kearney, Analog Devices