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High-Layer Count (HLC) PCB Technology for the 5G Era

High-Layer Count (HLC) PCB Technology for the 5G Era

One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.


Design and Development of 5G Devices: 5G Performance Ranges

Design and Development of 5G Devices: 5G Performance Ranges

How can engineers choose the correct performance range for their 5G application?


Extending Bandwidth to Crush X-Band Frequencies Using a Track-and-Hold Sampling Amplifier and RF ADC

Extending Bandwidth to Crush X-Band Frequencies Using a Track-and-Hold Sampling Amplifier and RF ADC

In this article, I show that designers can achieve 10 GHz bandwidth when using a THA in front of one of Analog Dialogue's RF market converters.


Ultrawideband DPD: The Rewards and Challenges of Implementation in Cable Distribution Systems

Ultrawideband DPD: The Rewards and Challenges of Implementation in Cable Distribution Systems

This article looks at new technologies regarding the existing cable network, in particular, power amplifier digital predistortion.


Wide-Area Wireless Platform Enables a New Wave of IoT systems

Wide-Area Wireless Platform Enables a New Wave of IoT systems

The next step of wide-area wireless connection is to bring the power of wireless to machine type communications (MTC). This will drive a revolution in services that will span sectors as diverse as manufacturing, city management, transportation, and energy.


Passive Intermodulation (PIM) Effects in Base Stations: Understanding the Challenges and Solutions

Passive Intermodulation (PIM) Effects in Base Stations: Understanding the Challenges and Solutions

Passive intermodulation represents the intermodulation products generated when two or more signals transit through a passive device with nonlinear properties. The interaction of mechanical components generally causes nonlinear elements.