Learn the optimal Wi-Fi version, flavor and configuration to select for your application—considering feature sets, costs, and power consumption. Get up to speed on MIMO, MU-MIMO, MU-OFDMA, and more.
November 16, 2023 by Franz Dugand, CEVA
Calibrating your image signal processor is a complex engineering task, but it's critical for digital image quality. Learn about these nuances and about the resources available to help you tackle these challenges.
September 28, 2023 by John Phillippe, NXP Semiconductors
Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).
August 31, 2023 by Rob Aitken, Synopsys
There are a host of tricky challenges that emerge when debugging complicated I2C and SPI errors. Learn how leveraging key features of today’s advanced oscilloscopes can smooth the way.
March 02, 2023 by Daniel Monforte, RIGOL Technologies
When developing lighting and indicator devices, surface mounted diode (SMD) LEDs offer a variety of benefits. Learn the options available—including multi-color SMD LEDs—and the advantages they provide.
February 16, 2023 by Mario Davila and Alan Sanchez, VCC
Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the process and how advanced CAM processing tools enable a smooth transition to the production phase.
January 26, 2023 by Edwin Robledo, Fusion 360 Electronics
With so many power tool options, designing for compatibility can be a struggle. Learn more about this challenge leveraging metal–oxide–semiconductor field-effect transistors (MOSFETs).
March 31, 2022 by Charles Keefer, Allegro MicroSystems
This article provides designers with recommendations for protection and low-power control components for power outlet design that both prevent overloads from damaging sensitive circuitry and maximize device efficiency.
January 26, 2021 by Ryan Sheahen, Littelfuse
This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical design in appliances. Learn what the standard entails and controllers to help meet these standards.
December 01, 2020 by Chad Solomon, Microchip Technology
NXP’s i.MX 8M Plus applications processor enables machine learning and intelligent vision for consumer applications and the industrial edge. Learn about the features of this processor and how it can be used in embedded vision systems.
October 22, 2020 by Jeff Steinheider, NXP Semiconductors
Autonomous drones and robots utilize small motors. These fast-spinning mini motors require miniature encoders and IC package sizes. This article shows how an optical sinusoidal encoder provides a higher resolution and increased speeds with a 2x3 mm dual simultaneous-sampling SAR-ADC.
August 11, 2020 by Bonnie Baker, Maxim Integrated
