Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
November 03, 2020 by Brian Niehoff, Samtec
The FixturFab DEV260 development fixture allows designers to debug or configure PCBAs during the development phase. See how it works in this example using the Sparkfun Power Delivery Board.
August 04, 2020 by Duncan Lowder, FixturFab
Manufacturing still takes a large portion of time in the electrical engineering cycle. This article discusses how software-driven automation and the IIoT can help hasten the manufacturing process.
December 17, 2019 by Shashank Samala, Tempo Automation
In part 12 of Resolving the Signal, we look at a power-supply noise design example to discuss which supplies are most critical when trying to increase a system's PSR. From that example, we offer best practices to maintain low power-supply noise and debugging tips for a system's overall noise performance.
January 29, 2019 by Bryan Lizon, Texas Instruments
Quad flat no-lead and discrete (or dual) flat no-lead packages provide a welcome increase in component density on a PCB area by eliminating leads. However, the solder connection quality cannot be tested by automated optical inspection. This article explores solutions to this often costly problem.
May 31, 2018 by Hans-Jürgen Funke, Nexperia
The growing use of wireless data is driving demand for communication systems that can transmit more data with greater energy efficiency, in order to both cut operating costs and, in mobile devices, to increase battery life.
December 19, 2017 by Ampleon
This article will briefly discuss isolation in the process control analog input module and the traditional approaches to achieving this. It then outlines an alternative high density, easy to design channel-to-channel isolation analog input module architecture.
March 14, 2017 by Van Yang, Analog Devices