Latest Assembly Industry Articles

In today's rapidly evolving aerospace and defense landscape, component engineers face an unprecedented challenge:…

In today's rapidly evolving aerospace and defense landscape, component engineers face an unprecedented challenge: ensuring every part they specify meets stringent compliance requirements while maintaining mission readiness and program viability.

Current initiatives for sustainable PCB manufacturing often focus more on regulatory compliance than environmental…

Current initiatives for sustainable PCB manufacturing often focus more on regulatory compliance than environmental responsibility. We will examine those initiatives plus newer ideas that could provide a better path forward for the PCB manufacturing industry.

Learn how surface-mount adapter evaluation modules (EVMs) help ease the transition to analog ICs with advanced package types.

Learn how surface-mount adapter evaluation modules (EVMs) help ease the transition to analog ICs with advanced package types.

The pros and cons of rigid-flex and traditional rigid PCBs will be compared to help you select the optimal technology for…

The pros and cons of rigid-flex and traditional rigid PCBs will be compared to help you select the optimal technology for your next electronic system design.

Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the…

Computer-aided manufacturing (CAM) is a critical part of modern electronics production. It’s helpful to understand the process and how advanced CAM processing tools enable a smooth transition to the production phase.

Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion…

Designing PCBs and enclosures in parallel is the best way to ensure high-quality system designs. Learn how to use Fusion 360 to marry the 2D domain of PCB design with the 3D domain of mechanical enclosure design.

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as…

Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.

The FixturFab DEV260 development fixture allows designers to debug or configure PCBAs during the development phase. See…

The FixturFab DEV260 development fixture allows designers to debug or configure PCBAs during the development phase. See how it works in this example using the Sparkfun Power Delivery Board.

This article explores the differences between two primary forms of soldering — reflow and wave — by providing details…

This article explores the differences between two primary forms of soldering — reflow and wave — by providing details around each type, including best uses for each method.

Manufacturing still takes a large portion of time in the electrical engineering cycle. This article discusses how…

Manufacturing still takes a large portion of time in the electrical engineering cycle. This article discusses how software-driven automation and the IIoT can help hasten the manufacturing process.

In part 12 of Resolving the Signal, we look at a power-supply noise design example to discuss which supplies are most…

In part 12 of Resolving the Signal, we look at a power-supply noise design example to discuss which supplies are most critical when trying to increase a system's PSR. From that example, we offer best practices to maintain low power-supply noise and debugging tips for a system's overall noise performance.

In this article, Parker Dillman, lead EE and co-founder of MacroFab, covers how to best prepare your PCB designs for…

In this article, Parker Dillman, lead EE and co-founder of MacroFab, covers how to best prepare your PCB designs for fabrication and assembly.

Part 10 of the Resolving the Signal series covers how clocks affect precision ADCs, touching on clock jitter, clock…

Part 10 of the Resolving the Signal series covers how clocks affect precision ADCs, touching on clock jitter, clock intermodulation and best PCB layout practices for clocking.

Quad flat no-lead and discrete (or dual) flat no-lead packages provide a welcome increase in component density on a PCB…

Quad flat no-lead and discrete (or dual) flat no-lead packages provide a welcome increase in component density on a PCB area by eliminating leads. However, the solder connection quality cannot be tested by automated optical inspection. This article explores solutions to this often costly problem.

The growing use of wireless data is driving demand for communication systems that can transmit more data with greater…

The growing use of wireless data is driving demand for communication systems that can transmit more data with greater energy efficiency, in order to both cut operating costs and, in mobile devices, to increase battery life.

This article will briefly discuss isolation in the process control analog input module and the traditional approaches to…

This article will briefly discuss isolation in the process control analog input module and the traditional approaches to achieving this. It then outlines an alternative high density, easy to design channel-to-channel isolation analog input module architecture.