Latest Digital Industry Articles

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn…

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.

This article explores the history of the 600 nm process, the reasons behind its phase-out, and what the industry has to…

This article explores the history of the 600 nm process, the reasons behind its phase-out, and what the industry has to look forward to as smaller, more efficient chips become the new standard.

Learn how open source silicon can provide better security than traditional measures like obscurity, but only if employed…

Learn how open source silicon can provide better security than traditional measures like obscurity, but only if employed correctly, managed well, and backed with appropriate resources.

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP…

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP blocks, including standard cells and libraries? This article will help you answer this question.

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both…

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).

USB-C/PD brings significant improvements to the USB connectivity world. In this article, learn how this technology…

USB-C/PD brings significant improvements to the USB connectivity world. In this article, learn how this technology simplifies system designs and the solutions available to implement USB-C/PD.